We are seeking a highly skilled and motivated Layout Developer to join our hardware development team. This role is focused on executing complex PCB layouts and high-density ASIC package designs for advanced optical sub-assemblies and integrated systems. The ideal candidate will work closely with electrical and mechanical engineers, as well as external suppliers, to ensure designs meet performance, manufacturability, and reliability requirements. This is a hands-on technical role with significant ownership of layout execution, design rule integration, and DFM processes.
Must Have :
- Proven experience in PCB layout and ASIC package design, preferably in high-speed and high-density applications.
- Proficiency with industry-standard EDA tools (e.g., Cadence Allegro, Mentor Graphics, Altium Designer).
- Strong understanding of signal integrity, power integrity, and thermal management principles.
- Experience with DFM practices and collaboration with PCB fabricators.
- Ability to interpret and implement complex design rules from suppliers and manufacturing partners.
- Skilled in creating and managing schematic symbols and footprints.
- Familiarity with schematic capture tools and processes.
- Excellent collaboration and communication skills across multidisciplinary teams.
- Bachelor’s degree in Electrical Engineering, Computer Engineering, or a related field; equivalent experience will be considered.
Nice to have:
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Optoelectronic experience
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Execute PCB layout for advanced optical sub-assemblies, incorporating high-speed, high-density design principles.
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Perform complex ASIC package layout, including substrate routing, bump placement, and integration with mechanical constraints.
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Collaborate with PCB and advanced substrate suppliers to understand and apply evolving design rules and technology roadmaps.
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Own and drive the Design for Manufacturability (DFM) process with PCB fabricators to ensure robust and cost-effective high performance designs.
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Develop and maintain schematic symbols and footprints to support accurate and efficient design workflows.
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Complete schematic capture with support from the electrical design team.
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Work closely with electrical and mechanical design teams to define floor planning and PCB constraints.
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Participate in design reviews and contribute to continuous improvement of layout methodologies and standards.
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关于Nokia

Nokia
PublicNokia Corporation is a Finnish multinational telecommunications, information technology, and consumer electronics corporation, originally established as a pulp mill in 1865.
10,001+
员工数
Espoo
总部位置
$24B
企业估值
评价
10条评价
3.8
10条评价
工作生活平衡
3.7
薪酬
3.2
企业文化
4.1
职业发展
2.8
管理层
3.4
72%
推荐率
优点
Good benefits
Supportive colleagues/management
Flexible work arrangements
缺点
Limited career advancement/growth opportunities
Management issues (poor communication, lack of direction)
Long hours/high workload
薪资范围
28个数据点
Mid/L4
Senior/L5
Mid/L4 · Electro-Optics Packaging Design Engineer
1份报告
$175,500
年薪总额
基本工资
$135,000
股票
-
奖金
-
$175,500
$175,500
面试评价
4条评价
难度
3.0
/ 5
时长
14-28周
录用率
25%
体验
正面 50%
中性 25%
负面 25%
面试流程
1
Application Review
2
Recruiter Screen
3
Technical Interview
4
HR Follow-up
5
Offer
常见问题
Technical Knowledge
Coding/Algorithm
Behavioral/STAR
Past Experience
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