In an increasingly connected world, the pandemic has highlighted just how essential telecom networks are to keeping society running. The Network Infrastructure group is at the heart of a revolution to connectivity, pushing the boundaries to deliver more and faster network capacity to people worldwide through our ambition, innovation, and technical expertise​

Join Optical Networks division, where innovation meets scale in the AI-driven data center era. With the recent acquisition of Infinera, we’ve united two industry leaders to create an optical networking powerhouse—combining cutting-edge technology with proven leadership to redefine the future of connectivity.​

Infinera is now part of the Nokia Corporation and its subsidiaries. When you apply, the information you share will be handled with care and used only for recruitment purposes within the group.

• JMP, DOE, SPC and their application to semiconductor manufacturing
• Working knowledge of semiconductor fabrication processes, and expertise in etch, deposition, photolithography and related processes.
• Strong initiative, leadership and communication skills.
• Experience with semiconductor process development, sustaining, new process introduction, and ramp to volume.
• Experience supporting a 24x7 fab operations team, writing and training of fab procedures, root cause analysis and problem resolution.

Education/Experience Required: B.S degree or equivalent experience.

Preferred Knowledge/Skills/Abilities:

• Technical depth in aspects of, etch, deposition, photolithography or similar tools and processes used for semiconductor manufacturing. 5 years’ experience in broad aspects of semiconductor wafer fabrication.
• Knowledge of wafer fab metrology tools, for example ellipsometry, CD-SEM, step height, and overlay metrology
• Clear communication of problems, challenges, and initiative in deploying solutions.
• A working knowledge and fab experience from pathfinding through mature production.
• A compound semiconductor background is a plus
  Same Posting Description for Internal and External Candidates
• Optimize plasma deposition, plasma etch, wet etch and clean, and related processes needed for PIC wafer fabrication.
• Work in teams to scale PIC wafer fabrication processes to larger wafer sizes, while meeting key objectives for PIC yield, uniformity, and end-of-line parametric performance.
• Troubleshoot wafer fabrication process problems to enable a smooth flow of production and development wafers in the fab. Support engineering process and tool owners in resolving fab process or equipment problems.
• Execute fabrication work and data collection to support process development for etch, and deposition, and photolithography roadmap activities needed for future PIC technology.
• Utilize metrology equipment and test structures to maintain process control across wafer fab process modules, improve production yield and enable and guide new process development.