Senior Mechanical Packaging Engineer

As part of Nokia’s Advanced Packaging R&D team, you will be responsible for the mechanical development of next generation, high performance electro-optic modules. You will be responsible for the integration of Silicon Photonics based Coherent optical transceivers within Nokia’s Photonic Service Engines, from inception stage to New Product Introduction.

You have:

• Advanced Degree in Mechanical Engineering or similar field.

• 5-8 years of extended experience in high-volume packaging of 2.5/3D packages.

• Expertise in next generation advanced photonics packaging technologies.

• Expertise in 3D CAD design, tolerance analysis, and Geometric Dimensioning and Tolerancing (GD&T) with Solid Works or similar software.

• Expertise in thermal and thermo-mechanical simulations using ANSYS or similar software.

• Experience with package and process design/development from design to production.

• Expertise in material properties and yield/failure mode analysis.

• Experience with documentation of fabrication, inspection, and assembly processes.

• Solid interpersonal, communication and problem-solving skills in order to interact with engineering staff, external vendors and contractors effectively.

• Experience with metrology techniques such as SEM/XSEM, confocal microscopy, or acoustic imaging.

• Expertise in materials property and process, yield analysis and enhancement, and failure mode and analysis.

• Experience with Industry Test Standards, such as JEDEC, EIA, Telcordia, Mil-Std, etc.

It would be nice if you also have:

• Experience in optical coupling design and assembly for optical engines.

• Experience in multilayer material bonding and heterogeneous integration.

• Experience in high-speed signal integrity design and analysis.

• Lead Package Design and Architecture in collaboration with cross-functional teams and stakeholders to ensure package requirements are met.

• Innovate designs, applying Design for Manufacturing principles and with an eye towards production volumes and cost targets.

• Drive key technology development to enable next generation product design.

• Perform FEA structural analysis, including linear, nonlinear and dynamic studies using software.

• Perform thermal analysis, and coupled-physics involving thermal–structural, thermal-mechanical stress and thermo-electric analyses.

• Own and maintain mechanical drawings and manufacturing documentation along with Bill of Materials for new products.

• Plan and Drive prototype assembly builds to enable deliveries for early design validation.

• Drive package debug activities during product validation and qualification.

• Survey new materials and vendors for all Advanced Packaging activities.

• Develop semiconductor and optical packaging processes in-house, or in close partnership with contract manufacturers.