Join our Applied R&D Electromechanical Design team and work at the forefront of multi‑discipline innovation, where you’ll tackle complex, target-oriented challenges spanning hardware, software and system design.
In this role, you will contribute to the design, development and implementation of electromechanical solutions for Base Transceiver Station (BTS) modules and units, including mechanics, thermal management, interconnections, power supply units (PSU), printed wiring board (PWB) layouts and overall hardware usability. You will systematically combine existing knowledge and best practices to solve real-world problems, provide techno‑economic consulting to internal and external stakeholders, and drive incremental improvements in products, operational processes and customer-specific features.
If you are passionate about creating high-quality, highly reliable, easy-to-install, and cost-efficient products in a detailed and technically challenging environment, we’d like to hear from you.
NIDC2026
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Mechanical or Thermal Engineering degree or equivalent.
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5-10+ years of experience in electronics cooling, preferably in the telecommunications industry with a good understanding of telecommunication network architecture and design.
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Experience using CFD thermal analysis tools (Flomerics tools from Siemens) and other heat transfer related analysis tools.
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Additional experience in electronics packaging would be an asset
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Good communication skills, both verbal and written.
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Can work efficiently both independently and as part of a team.
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Self-motivated enthusiastic team player with good written/verbal communication
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Excellent analytical skills and ability to build relationships across multiple teams
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Participate in the design and development of complex mechanical designs (product architecture, detailed specification definition for complex systems, technology (component) selection and the application of design tools/methods
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Work on device package, PCB assembly, and system level products/solutions.
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Collaborate with multi-disciplinary design teams and contribute at all stages of the product lifecycle from architecture through design, test, and final release, to find optimal thermal solutions for our products.
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Conduct CFD simulations using industry leading tools
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Perform empirical testing to validate and support simulations
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Investigate industry trends and interface with thermal component suppliers to learn and assess new technologies
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Provides sizing and estimates of work and review of product development schedules
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Nokiaについて

Nokia
PublicNokia Corporation is a Finnish multinational telecommunications, information technology, and consumer electronics corporation, originally established as a pulp mill in 1865.
10,001+
従業員数
Espoo
本社所在地
$24B
企業価値
レビュー
10件のレビュー
3.8
10件のレビュー
ワークライフバランス
3.7
報酬
3.2
企業文化
4.1
キャリア
2.8
経営陣
3.4
72%
知人への推奨率
良い点
Good benefits
Supportive colleagues/management
Flexible work arrangements
改善点
Limited career advancement/growth opportunities
Management issues (poor communication, lack of direction)
Long hours/high workload
給与レンジ
28件のデータ
Junior/L3
Mid/L4
Junior/L3 · Global 1830 TAC Engineer
1件のレポート
$141,314
年収総額
基本給
$108,703
ストック
-
ボーナス
-
$141,314
$141,314
面接レビュー
レビュー4件
難易度
3.0
/ 5
期間
14-28週間
内定率
25%
体験
ポジティブ 50%
普通 25%
ネガティブ 25%
面接プロセス
1
Application Review
2
Recruiter Screen
3
Technical Interview
4
HR Follow-up
5
Offer
よくある質問
Technical Knowledge
Coding/Algorithm
Behavioral/STAR
Past Experience
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