Overview

Microsoft Silicon, Cloud Hardware, and Infrastructure Engineering (SCHIE) is the team behind Microsoft’s expanding Cloud Infrastructure and responsible for powering Microsoft’s “Intelligent Cloud” mission. SCHIE delivers the core infrastructure and foundational technologies for Microsoft's over 200 online businesses including Bing, MSN, Office 365, Xbox Live, Teams, One Drive, and the Microsoft Azure platform globally with our server and data center infrastructure, security and compliance, operations, globalization, and manageability solutions. Our focus is on smart growth, high efficiency, and delivering a trusted experience to customers and partners worldwide and we are looking for passionate engineers to help achieve that mission.

As Microsoft's cloud business continues to grow the ability to deploy new offerings and hardware infrastructure on time, in high volume with high quality and lowest cost is of paramount importance. To achieve this goal, the AI Silicon Engineering team is instrumental in defining and delivering operational measures of success for hardware manufacturing, improving the planning process, quality, delivery, scale and sustainability related to Microsoft cloud hardware. We are looking for seasoned engineers with a dedicated passion for customer focused solutions, insight and industry knowledge to envision and implement future technical solutions that will manage and optimize the Cloud infrastructure.

We are looking for a Principal Physical Design Manager to join the team.

#SCHIE INDIA

Responsibilities

We are seeking a highly skilled Principal Physical Design Manager to join our dynamic team. As a key member of our semiconductor design team, you will be responsible for People management, Schip/SOC delivery involving physical design implementation and physical integration efforts working with multiple different stakeholders to ensure the successful development of cutting-edge semiconductor products.

· As a Physical Design Engineering Manager, your main role will be to lead a team in defining implementation and execution plan for a schip/SOC, execute the plan for successful tapeout by working with various stakeholders (RTL, IP, Methodology, DFT, Architecture etc) and drive the to achieve the best performance, power, and area (PPA) for AI system-on-chips (SOCs). This will involve optimizing technology, libraries, physical design, RTL design, and architecture.

o Leading the team in defining the implementation and execution plan for a subchip/SOC.

o Collaborating with various stakeholders such as RTL designers, IP teams, Methodology experts, DFT engineers, and Architects to ensure a cohesive plan.

o Executing the defined plan to ensure successful tapeout of the subchip/SOC.

o Driving the team to achieve the best performance, power, and area (PPA) for AI system-on-chips.

o Optimizing technology choices, libraries, physical design methodologies, RTL design strategies, and architectural decisions to meet performance targets.

o Ensuring that the physical design aspects align with the overall project goals and timelines.

o Providing technical guidance and mentorship to team members.

o Overseeing the development and implementation of physical design flows and methodologies.

o Collaborating with cross-functional teams to address any design challenges and optimize the design for manufacturability.

o Monitoring progress, identifying risks, and implementing mitigation strategies to ensure project success.

o Keeping abreast of the latest industry trends, tools, and techniques in physical design to drive innovation and efficiency within the team.

· You are expected to be able to work with limited direction, have keen attention to detail, and be able to provide crisp status of progress, issues, and risks on the program to the management team. Occasional travel may be required.

Qualifications

Bachelor's or master’s in electrical or computer engineering or related field with 15+ years of experience

· Experience in physical design implementation, signoff at block / sub system / sub-chip / SoC level.

· Experience in tapeouts of complex ASICs in leading edge technology

Ability to meet Microsoft, customer and/or government security screening requirements are required for this role. These requirements include but are not limited to the following specialized security screenings: Microsoft Cloud Background Check: This position will be required to pass the Microsoft Cloud Background Check upon hire/transfer and every two years thereafter.

his role will require access to information that is controlled for export under export control regulations, potentially under the U.S. International Traffic in Arms Regulations or Export Administration Regulations, the EU Dual Use Regulation, and/or other export control regulations.  As a condition of employment, the successful candidate will be required to provide either proof of their country of citizenship or proof of their US. residency or other protected status (e.g., under 8 U.S.C. 1324b(a)(3)) for assessment of eligibility to access the export-controlled information. To meet this legal requirement, and as a condition of employment, the successful candidate’s citizenship will be verified with a valid passport. Lawful permanent residents, refugees, and asylees may verify status using other documents, where applicable.

This position will be open for a minimum of 5 days, with applications accepted on an ongoing basis until the position is filled.

Microsoft is an equal opportunity employer. All qualified applicants will receive consideration for employment without regard to age, ancestry, citizenship, color, family or medical care leave, gender identity or expression, genetic information, immigration status, marital status, medical condition, national origin, physical or mental disability, political affiliation, protected veteran or military status, race, ethnicity, religion, sex (including pregnancy), sexual orientation, or any other characteristic protected by applicable local laws, regulations and ordinances. If you need assistance with religious accommodations and/or a reasonable accommodation due to a disability during the application process, read more about requesting accommodations.