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求人LendingClub

Lead Software Engineer - DevOps & Infrastrcuture

LendingClub

Lead Software Engineer - DevOps & Infrastrcuture

LendingClub

San Francisco, CA

·

On-site

·

Full-time

·

3w ago

必須スキル

Python

Java

AWS

Kubernetes

Terraform

Current Employees of Lending Club: Please apply via your internal Workday Account

Lending Club Corporation (NYSE: LC) is the parent company of Lending Club Bank, National Association, Member FDIC. We are the leading digital marketplace bank in the U.S., having helped our nearly 5 million members secure over $90 billion in loans to refinance high-cost debt and achieve their financial goals. Members today have mobile-first access to a growing range of products and services designed to work seamlessly together to deliver value in new ways. Everyone deserves a better financial future, and our team is committed to making that a reality. Join the Club!

About the Role

As a member of the DevOps team, you will build and support the applications and infrastructure that enable teams to configure, deploy, operate, and monitor the mission-critical services powering Lending Club. You will work in a highly collaborative and dynamic environment and help influence the strategy and direction of our infrastructure by building scalable solutions to complex technical problems.

What You'll Do

  • Build applications and infrastructure to enable Lending Club to deliver high-quality software quickly
  • Build monitoring and alerting infrastructure that is scalable and easy to maintain
  • Participate in an on-call rotation to investigate and resolve production issues
  • Ensure uptime and performance SLAs are met
  • Collaborate with operations, security, and engineering teams to build self-service frameworks that improve platform stability, reduce risk, and control costs
  • Work across the full infrastructure stack including design, architecture, capacity planning, monitoring, alerting, security, scaling, failover, and recovery
  • Partner with engineering teams on new feature rollouts
  • Troubleshoot issues independently and support engineers via shared channels such as Slack
  • Ramp on team systems and contribute to roadmap priorities and ongoing DevOps support

About You

  • 8+ years of experience operating enterprise-class infrastructure
  • 5+ years of coding experience in an object-oriented language such as Java or Python
  • Strong experience with AWS, including IAM, EC2, ASG, ELB/ALB, AMI, EBS, VPC, S3, Route53, Code Deploy, ECR, API Gateway, and Bedrock
  • Hands-on experience with Terraform, Kubernetes/EKS, containers, and Helm
  • Experience with Grafana and Prometheus
  • Familiarity with agentic frameworks and MCP tools
  • Expertise in building automated deployment pipelines and scalable systems
  • Strong system-level thinking with the ability to move across layers of the stack
  • Ability to independently troubleshoot and support other engineers
  • Experience using AI to improve output quality, with sound judgment on limitations and human oversight
  • Bachelor’s degree in a related field; or equivalent work experience

Work Location San Francisco:

The above locations are eligible offices for this role. The locations have been determined to foster in-person collaboration with this role’s team or the related business lines. We utilize a hybrid work model, and our teams are in-office Tuesdays, Wednesdays, and Thursdays. In-person attendance is essential for this role’s success, and remote placement will not be considered. Lending Club offers relocation, based on actual job level.

Time Zone Requirements Primarily PT:

While the position will primarily work local hours, Lending Club is headquartered in Pacific Time and our ideal candidate will be flexible working across time zones when necessary.

Travel Requirements As needed travel to Lending Club offices and/or other locations, as needed.

Compensation:

The target base salary range for this position is 185,000-215,000. The base salary of the role will be determined by job-related knowledge, experience, education, skills, and location. Base salary is just one part of Lending Club’s Total Rewards package. You may also be eligible for long-term awards (equity) and an annual bonus (which is based on company performance, employee performance and eligible earnings).

We’re creating new financial services solutions for our members based on fairness, simplicity, and heart, and we treat our employees the same way. We offer a competitive benefits package that includes medical, dental and vision plans for employees and their families, 401(k) match, health and wellness programs, flexible time off policies for salaried employees, up to 16 weeks paid parental leave and more.

Lending Club is an equal opportunity employer and dedicated to diversity, equity, and inclusion in the workplace. We do not discriminate on the basis of race, religion, color, national origin, sex (including pregnancy, childbirth, reproductive health decisions, or related medical conditions), gender, gender identity, gender expression, sexual orientation, age, marital status, veteran status, disability status, political views or activity, or other applicable legally protected characteristics. We believe that a variety of perspectives will make our teams and business stronger as we work together to transform the traditional banking system.

We are committed to providing reasonable accommodations for qualified individuals with disabilities in our job application process. If you need assistance or an accommodation due to a disability, please contact us at interviewaccommodations@lendingclub.com.

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LendingClubについて

LendingClub

Financial services company.

501-1,000

従業員数

San Francisco

本社所在地

$1.5B

企業価値

レビュー

3.5

1件のレビュー

ワークライフバランス

3.0

報酬

3.0

企業文化

2.5

キャリア

2.0

経営陣

3.0

25%

友人に勧める

改善点

Company reputation/brand perception issues

Not considered top-tier fintech

Grouped with lower-quality competitors

給与レンジ

336件のデータ

Senior/L5

Senior/L5 · Senior Application Security Engineer

1件のレポート

$225,784

年収総額

基本給

$173,680

ストック

-

ボーナス

-

$225,784

$225,784

面接体験

1件の面接

難易度

3.0

/ 5

期間

21-35週間

面接プロセス

1

Application Review

2

HR Screen

3

Hiring Manager Interview

4

Technical Assessment

5

Panel Interview

6

Offer

よくある質問

Technical Knowledge

Behavioral/STAR

Past Experience

Case Study

Risk Assessment