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职位JPMorgan Chase

Software Engineer III - Cloud Platform Engineer

JPMorgan Chase

Software Engineer III - Cloud Platform Engineer

JPMorgan Chase

Bengaluru, Karnataka, India, IN

·

On-site

·

Full-time

·

1mo ago

必备技能

Python

AWS

Kubernetes

Go

Terraform

Kafka

We know that people want great value combined with an excellent experience from a bank they can trust, so we launched our digital bank, Chase UK, to revolutionise mobile banking with seamless journeys that our customers love. We're already trusted by millions in the US and we're quickly catching up in the UK – but how we do things here is a little different. We're building the bank of the future from scratch, channelling our start-up mentality every step of the way – meaning you'll have the opportunity to make a real impact.

As a Software Engineer III at JPMorgan Chase within the International Consumer Bank, you will be joining our Cloud Platform Engineering tribe, which is at the heart of a cutting-edge cloud-native AWS infrastructure that powers the Chase UK bank that is trusted by over 2 million customers. You will be exposed to a wide spectrum of technologies such as Kubernetes clusters, connectivity, databases, kafka clusters, as well as numerous opportunities to create automations to eliminate toil and improve developer experience.

We're looking for people who have a curious mindset, thrive in collaborative squads, and are passionate about new technology. By their nature, our people are also solution-oriented, commercially savvy and have a head for fintech. We work in tribes and squads that focus on specific products and projects – and depending on your strengths and interests, you'll have the opportunity to move among squads within the tribe.

Job Responsibilities:

  • Maintain our AWS cloud infrastructure to ensure the bank’s 24/7 operation with a focus on stability, performance, security and compliance

  • Maintain and improve stability, security and performance of connectivity for our customers, in-between AWS accounts, as well as in-between Chase and third parties

  • Maintain existing deployment pipeline and migrate to strategic CI/CD tooling using a variety of programming languages (Bash/Python/Go) as necessary

  • Maintain a cloud platform for application developers and provide support to improve their SDLC and developer experience

  • Participate in on-call rota

Required Qualifications, Capabilities, and Skills:

  • Experience developing and maintaining applications in the public cloud (we use AWS)

  • Experience managing public cloud infrastructure using infra-as-code technologies (we use Terraform)

  • Good knowledge of AWS Networking

  • Good knowledge of Kubernetes clusters' operations (we use EKS)

  • Good knowledge of programming using a modern language (Python/Go)

  • Experience in developing and maintaining CI/CD pipelines that covers the full SDLC

  • Excellent understanding of DevOps principles and SDLC best practices

  • Excellent communication and collaboration skills

  • Strong analytical and problem-solving abilities

Preferred Qualifications, Capabilities, and Skills:

  • Familiar with software engineering security best practices in a cloud environment

  • Experience developing unit, integration and end-to-end software tests

#ICBCareers #ICBEngineering

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关于JPMorgan Chase

JPMorgan Chase

JPMorgan Chase & Co. is an American multinational banking institution headquartered in New York City and incorporated in Delaware. It is the largest bank in the United States, and the world's largest bank by market capitalization as of 2025.

300,000+

员工数

New York City

总部位置

$500B

企业估值

评价

3.8

10条评价

工作生活平衡

3.2

薪酬

4.1

企业文化

3.8

职业发展

3.0

管理层

2.5

65%

推荐给朋友

优点

Good benefits and compensation

Supportive and collaborative environment

Flexible work arrangements

缺点

Long hours and heavy workload

Management issues and lack of direction

High stress during peak times

薪资范围

41个数据点

Junior/L3

Mid/L4

Senior/L5

Junior/L3 · Analytics Solutions Associate

1份报告

$139,000

年薪总额

基本工资

$107,000

股票

-

奖金

-

$139,000

$139,000

面试经验

5次面试

难度

3.0

/ 5

时长

14-28周

录用率

40%

体验

正面 20%

中性 80%

负面 0%

面试流程

1

Application Review

2

HireVue Video Interview

3

Recruiter Screen

4

Superday/Panel Interview

5

Final Interview

6

Offer

常见问题

Behavioral/STAR

Technical Knowledge

Culture Fit

Past Experience

Case Study