Job Details:

Job Description:

As a Memory Design Graduate Talent, you will be part of Intel Design Enablement (DE) focused on pathfinding and development of advanced memory technology and circuits to enable best-in-class memory collateral/IP and product design across all generations of Intel process technology.

As a member of this team, your responsibilities include (but not limited to):

• Memory pathfinding activities and power performance area (PPA) optimization through design technology co-optimization (DTCO)

• Product/design enablement

• Memory bitcell and complex periphery IC layout and automation

• Memory array/IP design, memory circuit innovation, testchip design/execution/validation Pre/post-Si validation/debug to enable yield and parametric tracking/ramp

"Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to our staffing team at malaysia.staffing@intel.com."

Qualifications:

Minimum Qualifications:

• You should have Bachelor/Master/PhD in Electrical Engineering, Computer Engineering, Computer Science, or other related Electrical Scientific STEM field.

• Proficient in TCL, Perl or Python programming language.

• Unix/Linux operating system

Preferred Qualifications:

• Ability to work in a fast-paced, collaborative, and often intense project schedule.

• Excellent communication and interpersonal skills, a good team-player as well as able to work independently.

• Creative mind and self-motivated.

• Analytical problem solving and multitasking.

• Able to do pathfinding or research independently to find solutions.

#designenablement

Job Type:

Intel Contract Employee:

Shift:

Shift 1 (Malaysia)

Primary Location:

Malaysia, Penang

Additional Locations:

Business group:

Intel Foundry strives to make every facet of semiconductor manufacturing state-of-the-art while delighting our customers -- from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling our customers to design leadership products, global manufacturing scale and supply chain, through the continuous yield improvements to advanced packaging all the way to final test and assembly. We ensure our foundry customers' products receive our utmost focus in terms of service, technology enablement and capacity commitments. Employees in the Foundry Technology Manufacturing are part of a worldwide factory network that designs, develops, manufactures, and assembly/test packages the compute devices to improve the lives of every person on Earth.

Posting Statement:

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

Position of Trust

N/A

Work Model for this Role

This role will be eligible for our hybrid work model which allows employees to split their time between working on-site at their assigned Intel site and off-site. Job posting details (such as work model, location or time type) are subject to change.

ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.