Job Details:

Job Description:

Join Intel's Packaging Module Development team and play a pivotal role in shaping the future of assembly packaging technologies. As a Packaging Module Development Engineer, you will develop innovative material and design solutions that drive Intel's roadmap for next-generation assembly and packaging solutions. Your contributions will directly impact the efficiency, reliability, and quality of Intel's manufacturing operations, enabling cutting-edge technologies to thrive in competitive markets. This is an excellent opportunity to work on complex challenges, collaborate with cross-functional teams, and lead advancements that redefine industry standards.

Key Responsibilities

• Develop and qualify thermal material solutions such as Integrated Heat Spreaders (IHS) aligned with Intel's packaging technology roadmap.
• Define specifications for incoming materials that meet yield, reliability, quality and cost targets through close collaboration with internal partners (module, supply chain, design, core competency and integration teams) and external suppliers
• Develop manufacturing design rules by balancing design for performance (DFP), design for manufacturability (DFM) and design for cost (DFC) principles
• Own technical root cause finding and problem solving for material-related issues that arise during both development and high-volume manufacturing
• Continuously improve the business processes and best-known methodologies for designing and enabling high performance thermal material solutions in high volume based on evolving product requirements

Qualifications:

Minimum qualifications are required to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Requirements listed would be obtained through a combination of industry relevant job experience, internship experiences and or schoolwork/classes/research.

Minimum Qualifications

• Bachelor's degree in Materials Science and Engineering, Metallurgical Engineering or Mechanical Engineering or related field with 2+ years of relevant experience.
• OR Master's degree in Materials Science and Engineering, Metallurgical Engineering or Mechanical Engineering or related field.

The experience outlined above should reflect a combination of the following qualifications:

• Statistical Process Control (SPC) and Design of Experiments (DOE) principles.
• Experience in developing innovative solutions using fundamental science and engineering concepts.
• Mechanical design software such as Solid Works or AutoCAD.
• Mechanical drawings and Geometric Dimensioning and tolerancing (GD and T)

Preferred Qualifications

• PhD degree in Materials Science and Engineering, Metallurgical Engineering or Mechanical Engineering or related field.
• Demonstrated ability to lead technical innovation and manage complex, time-critical technical projects.
• Familiarity with high precision manufacturing of metallic materials, such as stamping and CNC machining
• Understanding of semiconductor fabrication processes and technologies.
• Familiarity with supply chain management in a manufacturing or materials qualification environment

Job Type:

College Grad

Shift:

Shift 1 (United States of America)

Primary Location:

US, Arizona, Phoenix

Additional Locations:

Business group:

Intel Foundry strives to make every facet of semiconductor manufacturing state-of-the-art while delighting our customers -- from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling our customers to design leadership products, global manufacturing scale and supply chain, through the continuous yield improvements to advanced packaging all the way to final test and assembly. We ensure our foundry customers' products receive our utmost focus in terms of service, technology enablement and capacity commitments. Employees in the Foundry Technology Manufacturing are part of a worldwide factory network that designs, develops, manufactures, and assembly/test packages the compute devices to improve the lives of every person on Earth.

Posting Statement:

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

Position of Trust

N/A

Benefits

We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel.

Annual Salary Range for jobs which could be performed in the US: $99,030.00-188,890.00 USD

The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.

Work Model for this Role

This role will be eligible for our hybrid work model which allows employees to split their time between working on-site at their assigned Intel site and off-site. Job posting details (such as work model, location or time type) are subject to change.

ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.