Thermal and Performance Architect:

Description -

Job Summary

This role serves as a senior mechanical and thermal engineering leader responsible for driving large, complex initiatives that directly impact the company’s long-range goals and product strategy. The position defines and leads 3–5 year technology roadmaps for thermal and mechanical engineering, identifying key inflection points in Phase Change Materials (PCM), vapor chamber technologies, and active cooling innovations.

The role operates at the system architecture level, leveraging deep technical expertise in thermal fluids, simulation, and hardware design to influence decision-making at the highest organizational levels. This leader partners closely with silicon vendors, software, firmware, and hardware teams to co-design solutions optimized for performance, performance per watt, acoustics, skin temperature, and form factor, while ensuring compliance with enterprise standards across multiple organizations and architectures.

Responsibilities

• Lead multi-year thermal technology roadmaps, identifying and advancing innovations in PCM, vapor chambers, fans, heat pipes, and active cooling solutions across the portfolio

• Partner with silicon vendors to co-design systems based on power delivery profiles and thermal maps, influencing early platform and architectural decisions

• Lead deep-dive architectural and competitive analysis of thermal solutions to maintain leadership in performance, performance per watt, and industrial design constraints

• Drive development of advanced CFD workflows to predict both steady-state and transient thermal behavior during early architecture phases

• Establish system-level simulation frameworks that correlate thermal throttling behaviors with real-world software benchmarks and workloads

• Architect advanced thermal tuning algorithms to balance skin temperature, fan acoustics, and system performance for real-life use cases

• Lead multiple project teams of mechanical and thermal engineers, along with internal and outsourced development partners, across all phases of development including concept, design, validation, tooling, testing, and production readiness

• Provide architectural consultation, design input, and feedback across new product development and design reviews spanning multiple organizations

• Review designs and project activities for compliance with engineering standards, development guidelines, and quality requirements, providing actionable feedback to improve product outcomes

• Troubleshoot complex mechanical, thermal, electrical, and system-level issues with minimal supervision

• Guide and mentor less-experienced engineers, setting a standard for thermal design innovation, rigor, and excellence

• Participate in identifying and developing future technical leaders within the organization

Education & Experience Recommended

• Bachelor’s or Master’s degree in Mechanical Engineering with a focus on Thermal Fluids

• Typically 10+ years of experience in similar roles such as Principal or Senior Thermal Performance Engineer

• Extensive experience across the hardware development lifecycle, from early architecture through production

Required Technical Expertise

• Strong thermal analysis expertise using CFD tools such as Flotherm XT, FLOEFD, Icepak, or equivalent

• Experience using thermal mockups and validation methods to confirm thermal solutions during early architecture phases

• Hands-on experience with:

• Fans, heat pipes, vapor chambers, fluidic and microfluidic cooling designs

• Relating skin temperature, acoustics, and system performance

• Designing sheet metal and plastic components, including associated production tooling and manufacturing processes

• Solid understanding of manufacturing and ODM production processes (strong plus)

• Proficiency with CAD and simulation tools, including:

• PTC Creo, Solid Works, ANSYS

• Finite Element Methods and 3D modeling

Knowledge & Skills

• Mechanical and Thermal Engineering

• Thermal Management & Performance Optimization

• New Product Development & Product Lifecycle Management

• Prototyping and Manufacturing Processes

• Injection Molding, Machining, Sheet Metal Design

• Engineering Design Process & System Architecture

Cross-Organizational Skills

• Effective executive-level communication

• Results orientation and ownership mindset

• Learning agility in fast-evolving technology environments

• Digital fluency across hardware–software boundaries

• Strong customer and user-centric design perspective

Impact & Scope

• Influences multiple functions and disciplines across HP

• Shapes long-term thermal and mechanical strategy across the product portfolio

Complexity

• Invents, develops, and introduces new thermal methods, frameworks, and technologies that impact multiple disciplines, platforms, and work groups

Disclaimer This job description describes the general nature and level of work performed in this role. It is not intended to be an exhaustive list of all duties, skills, responsibilities, knowledge, etc. These may be subject to change and additional functions may be assigned as needed by management.

The pay range for this role is $174,050 to$278,450 USD annually with additional opportunities for pay in the form of bonus and/or equity (applies to United States of America candidates only). Pay varies by work location, job-related knowledge, skills, and experience.
Benefits:HP offers a comprehensive benefits package for this position, including:

• Health insurance
• Dental insurance
• Vision insurance
• Long term/short term disability insurance
• Employee assistance program
• Flexible spending account
• Life insurance
• Generous time off policies, including;
• 4-12 weeks fully paid parental leave based on tenure
• 11 paid holidays
• Additional flexible paid vacation and sick leave (US benefits overview)

The compensation and benefits information is accurate as of the date of this posting. The Company reserves the right to modify this information at any time, with or without notice, subject to applicable law.

Job -

Engineering

Schedule -

Full time

Shift -

No shift premium (United States of America)

Travel -

Relocation -

Equal Opportunity Employer (EEO) -

HP, Inc. provides equal employment opportunity to all employees and prospective employees, without regard to race, color, religion, sex, national origin, ancestry, citizenship, sexual orientation, age, disability, or status as a protected veteran, marital status, familial status, physical or mental disability, medical condition, pregnancy, genetic predisposition or carrier status, uniformed service status, political affiliation or any other characteristic protected by applicable national, federal, state, and local law(s).

Please be assured that you will not be subject to any adverse treatment if you choose to disclose the information requested. This information is provided voluntarily. The information obtained will be kept in strict confidence.

For more information, review HP’s EEO Policy or read about your rights as an applicant under the law here: “Know Your Rights: Workplace Discrimination is Illegal"