Senior Design Lead

Job Summary

• Role: IC Packaging Design Engineer

• Project Duration: 1 year

• Start date: Beginning of Q4’26

• No of resources: 4

• Location: Chandler, AZ (primary) or Hillsboro, OR (secondary)

• Experience Tier: Senior-level (primary); Mid-level (secondary)

· Senior-Level: ~10+ years in IC packaging / package design

· Mid-Level: 4–6+ years (MS) or 6+ years (BS) in IC packaging / package design

• Education: Bachelor’s or Master’s degree in Electrical /Electronics Engineering

• Experience:

· Strong hands-on experience in Siemens (Mentor) Xpedition (XPD); Alternatively: Cadence Allegro/Advanced Package Designer (APD / SiP)

· Candidates should have experience in the below domains:

o Physical Design & Layout

o Substrate design and layout

o SI/PI aware design implementation

o Design for performance, manufacturability, yield, and reliability

o Design rule compliance

Key Responsibilities

1. To leverage design expertise to ensure that software and products exhibit user-friendliness, intuitiveness, and alignment with user expectations, contributing to the creation of seamless user experiences.

2. To lead a team of designers, provide guidance, and ensuring the delivery of high-quality design solutions in alignment with the overall business goals.

3. To present design concepts and play a crucial role in shaping the overall design vision and strategy.

4. To stay abreast of industry trends, emerging technologies to drive innovation and excellence in design.

Skill Requirements

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Other Requirements

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