Senior Designer - ATE, LabVIEW

Job Summary

NPI, Support for engineering activities including prototypes and new product introduction.LaMP & Lo CoW Manufacturing will need a multi-disciplinary team including hands-on operations in a Cleanroom for advanced packaging and testing. The technical expertise required to execute manufacturing processes for Laser-on-Module-Package (LaMP) and Laser-on-Carrier-on-Wafer (Lo CoW) components

Key Responsibilities

Advanced Packaging & Assembly Expertise:

· Photonic Packaging Engineers: Deep knowledge of flip-chip bonding, die-attach, and high-precision alignment (sub-micron level).

· Wafer Fab Technicians: Skilled in wafer dicing, grinding, and polishing, specifically for silicon-on-insulator (SOI) materials.

· Process Engineers: Specialists in Underfill and Encapsulation to ensure thermal and mechanical stability.

Electro-Optical Test Engineering:

· Test Engineers (Optical/RF): Experience with L-I-V (Light-Current-Voltage) characterization and spectral analysis.

· Hardware-in-the-Loop (HIL) Specialists: Talent capable of operating automated test equipment (ATE) and handling fiber-optic coupling.

· Quality Assurance (QA) Metrology: Experts in Scanning Electron Microscopy (SEM) and Acoustic Microscopy.

Equipment & Cleanroom Operations:

· Equipment Maintenance Engineers: Expertise in troubleshooting high-precision pick-and-place and assembly machinery.

· Yield Engineers: Focused on statistical process control (SPC) to maximize efficiency and reduce scrap.

· Cleanroom Operators: Certified staff experienced in contamination control (ISO Class 5/100) and ESD safety.

Engineering Support & NPI:

· NPI Managers: To coordinate the transition from engineering prototypes to stable manufacturing.

· Materials Scientists: Specialized in thermal management for high-power laser modules.

Skill Requirements

Advanced Packaging & Assembly Expertise:

· Photonic Packaging Engineers: Deep knowledge of flip-chip bonding, die-attach, and high-precision alignment (sub-micron level).

· Wafer Fab Technicians: Skilled in wafer dicing, grinding, and polishing, specifically for silicon-on-insulator (SOI) materials.

· Process Engineers: Specialists in Underfill and Encapsulation to ensure thermal and mechanical stability.

Electro-Optical Test Engineering:

· Test Engineers (Optical/RF): Experience with L-I-V (Light-Current-Voltage) characterization and spectral analysis.

· Hardware-in-the-Loop (HIL) Specialists: Talent capable of operating automated test equipment (ATE) and handling fiber-optic coupling.

· Quality Assurance (QA) Metrology: Experts in Scanning Electron Microscopy (SEM) and Acoustic Microscopy.

Equipment & Cleanroom Operations:

· Equipment Maintenance Engineers: Expertise in troubleshooting high-precision pick-and-place and assembly machinery.

· Yield Engineers: Focused on statistical process control (SPC) to maximize efficiency and reduce scrap.

· Cleanroom Operators: Certified staff experienced in contamination control (ISO Class 5/100) and ESD safety.

Engineering Support & NPI:

· NPI Managers: To coordinate the transition from engineering prototypes to stable manufacturing.

· Materials Scientists: Specialized in thermal management for high-power laser modules.

Other Requirements

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