Design Lead

Job Summary

The Mechanical Engineer – Core Design plays a key role in the design and development of semiconductor equipment, Optical design, mechanical modules, sheet-metal structures, precision assemblies, and complex subsystems. The role requires strong expertise in UG NX, GD&T, Sheet Metal, Tolerance Stack-up, Semiconductor Fabrication Processes, Material Selection, SOM, and FEA (Structural & Thermal). This engineer will lead concept creation, detailed design, validation, and cross-functional collaboration to deliver high-quality mechanical solutions.

• 1.

Key Responsibilities:

• Core Mechanical Design: Create detailed 3D models and assemblies using UG NX, develop innovative concepts, apply DFM/DFA principles, and conduct trade-off analysis.

• GD&T & Tolerance Engineering: Apply ASME Y14.5 standards, conduct 2D/3D tolerance stack-ups, and validate critical tolerances.

• Sheet Metal & Machined Component Design: Design enclosures, brackets, frames, and apply sheet-metal design rules including bend allowances and manufacturability.

• Semiconductor Fabrication Process Knowledge: Understand vacuum design, plasma interaction, thermal loads, contamination control, and process module interfaces.

• Material Selection & SOM: Select materials based on mechanical, thermal, chemical, and vacuum criteria; develop SOM documentation and risk analysis.

• FEA – Structural & Thermal: Perform structural/thermal analysis, evaluate static/dynamic loads, perform modal studies, and validate heat dissipation.

• Cross-Functional Collaboration: Work with electrical, systems, manufacturing, supply chain, and reliability teams; drive design reviews.

• Testing, Validation & Release: Support prototype builds, perform functional testing, implement ECOs, and release designs through PLM tools.

Required Technical Skills:

• UG NX (Expert Level)
• GD&T (ASME Y14.5)
• Sheet Metal Design and Drafting
• Tolerance Stack-up (Worst Case & Statistical)
• Semiconductor Fabrication Process Knowledge
• Material Selection for Vacuum & Cleanroom Applications
• Structural & Thermal FEA (ANSYS/Abaqus)
• SOM Documentation Knowledge
• DFM/DFA Application
• PLM Tools (Teamcenter/Windchill)

Professional Skills:

• Strong communication and presentation abilities.
• Ability to lead technical discussions and decisions.
• Analytical problem-solving and root-cause analysis capability.
• Mentorship experience with junior engineers.

1. Education
   Bachelor’s or master’s degree in mechanical engineering or related field.

Experience Range:

8-12 years of hands-on experience in mechanical design engineering, preferably in semiconductor equipment, Optical Design, high-tech capital machinery, or precision systems.

Key Responsibilities

1. To collaborate with key stakeholders, to understand business objectives and work with them to integrate design thinking into software/product development.
2. To lead a team of designers, provide guidance, and ensuring the delivery of high-quality design solutions in alignment with the overall business goals.
3. To present design concepts and strategies to stakeholders and gather feedback.
4. To establish and maintain design standards, guidelines, and best practices.
5. To stay abreast of industry trends, emerging technologies to drive innovation and excellence in design.

Skill Requirements

The Mechanical Engineer – Core Design plays a key role in the design and development of semiconductor equipment, Optical design, mechanical modules, sheet-metal structures, precision assemblies, and complex subsystems. The role requires strong expertise in UG NX, GD&T, Sheet Metal, Tolerance Stack-up, Semiconductor Fabrication Processes, Material Selection, SOM, and FEA (Structural & Thermal). This engineer will lead concept creation, detailed design, validation, and cross-functional collaboration to deliver high-quality mechanical solutions.

• 1.

Key Responsibilities:

• Core Mechanical Design: Create detailed 3D models and assemblies using UG NX, develop innovative concepts, apply DFM/DFA principles, and conduct trade-off analysis.

• GD&T & Tolerance Engineering: Apply ASME Y14.5 standards, conduct 2D/3D tolerance stack-ups, and validate critical tolerances.

• Sheet Metal & Machined Component Design: Design enclosures, brackets, frames, and apply sheet-metal design rules including bend allowances and manufacturability.

• Semiconductor Fabrication Process Knowledge: Understand vacuum design, plasma interaction, thermal loads, contamination control, and process module interfaces.

• Material Selection & SOM: Select materials based on mechanical, thermal, chemical, and vacuum criteria; develop SOM documentation and risk analysis.

• FEA – Structural & Thermal: Perform structural/thermal analysis, evaluate static/dynamic loads, perform modal studies, and validate heat dissipation.

• Cross-Functional Collaboration: Work with electrical, systems, manufacturing, supply chain, and reliability teams; drive design reviews.

• Testing, Validation & Release: Support prototype builds, perform functional testing, implement ECOs, and release designs through PLM tools.

Required Technical Skills:

• UG NX (Expert Level)
• GD&T (ASME Y14.5)
• Sheet Metal Design and Drafting
• Tolerance Stack-up (Worst Case & Statistical)
• Semiconductor Fabrication Process Knowledge
• Material Selection for Vacuum & Cleanroom Applications
• Structural & Thermal FEA (ANSYS/Abaqus)
• SOM Documentation Knowledge
• DFM/DFA Application
• PLM Tools (Teamcenter/Windchill)

Professional Skills:

• Strong communication and presentation abilities.
• Ability to lead technical discussions and decisions.
• Analytical problem-solving and root-cause analysis capability.
• Mentorship experience with junior engineers.

1. Education
   Bachelor’s or master’s degree in mechanical engineering or related field.

Experience Range:

8-12 years of hands-on experience in mechanical design engineering, preferably in semiconductor equipment, Optical Design, high-tech capital machinery, or precision systems.

Other Requirements

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