Senior Technical Architect

Job Summary

6 Years industry experience with Cadence Allegro designer from setting up layout constraints, placement, routing and releasing to fab.Experience with DDR3/4/5, Wi-Fi6/63/7, USB3.x, HDMI, Display Ports, SGMII, USB, SATA, PCIe, Intel, AMD, Qualcomm So Cs, High-speed mother board PCB Layout design, Analog, RF, controlled impedance routing and High-Power boards.Experience with Flex PCB, Flex+Rigid PCB, Rigid PCB Design Experience with Type3 & Type4 PCB designs.Knowledge of PCB technology (back drilling, micro vias, blind via, buried via, stacked via, staggered via, etc.). Knowledge of PCB manufacturing process, DFM and DFT.Able to create symbols and footprints. Good experience with IPC Standards.Ability to design large, complex multilayer PCBs with various stack up topologies.Ability to define stack up and work closely with PCB house.Good experience with CAM350 (Gerber verification)Good experience in Power electronics domain Ability to read and understand Electronic Schematics, Components Datasheet

Key Responsibilities

6 Years industry experience with Cadence Allegro designer from setting up layout constraints, placement, routing and releasing to fab.Experience with DDR3/4/5, Wi-Fi6/63/7, USB3.x, HDMI, Display Ports, SGMII, USB, SATA, PCIe, Intel, AMD, Qualcomm So Cs, High-speed mother board PCB Layout design, Analog, RF, controlled impedance routing and High-Power boards.Experience with Flex PCB, Flex+Rigid PCB, Rigid PCB Design Experience with Type3 & Type4 PCB designs.Knowledge of PCB technology (back drilling, micro vias, blind via, buried via, stacked via, staggered via, etc.). Knowledge of PCB manufacturing process, DFM and DFT.Able to create symbols and footprints. Good experience with IPC Standards.Ability to design large, complex multilayer PCBs with various stack up topologies.Ability to define stack up and work closely with PCB house.Good experience with CAM350 (Gerber verification)Good experience in Power electronics domain Ability to read and understand Electronic Schematics, Components Datasheet

Skill Requirements

6 Years industry experience with Cadence Allegro designer from setting up layout constraints, placement, routing and releasing to fab.Experience with DDR3/4/5, Wi-Fi6/63/7, USB3.x, HDMI, Display Ports, SGMII, USB, SATA, PCIe, Intel, AMD, Qualcomm So Cs, High-speed mother board PCB Layout design, Analog, RF, controlled impedance routing and High-Power boards.Experience with Flex PCB, Flex+Rigid PCB, Rigid PCB Design Experience with Type3 & Type4 PCB designs.Knowledge of PCB technology (back drilling, micro vias, blind via, buried via, stacked via, staggered via, etc.). Knowledge of PCB manufacturing process, DFM and DFT.Able to create symbols and footprints. Good experience with IPC Standards.Ability to design large, complex multilayer PCBs with various stack up topologies.Ability to define stack up and work closely with PCB house.Good experience with CAM350 (Gerber verification)Good experience in Power electronics domain Ability to read and understand Electronic Schematics, Components Datasheet

Other Requirements

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