Monitor, sustain, and support fabrication processes encompassing areas of lithography, thin film, etch, clean, thermal, metrology or characterization and backside wafer thinning. Ensure process robustness, efficiency and consistency by providing technical support to technicians.

Work with process, metrology and integration engineers to review, propose, optimize, improve and implement various wafer fabrication processes and new equipment introduction for safety enhancement, yield improvement, defectivity reduction, and manufacturability.

Enhance area process control plan and the process capability through implementation of best known manufacturing methods, lean manufacturing principle and the statistical process control (SPC).

Drive problem resolution process associated with the quality excursion in the fab area encompassing data analytics, methodical problem-solving, failure analysis (FA), design of experiments (DOE), and mistake-proof.

Document process specifications, procedures, out of control action plan (OCAP) and train the technicians.

Bachelor's degree in Electrical Engineering, Applied Physics, Optics, Material Sciences, Mechanical Engineering, a related technical field, or equivalent practical experience.

5 years of experience in a production semiconductor wafer fab clean room environment (e.g. encompassing area of lithography, thin film, etch, clean, metallization, thermal, backside wafer thinning, and wafer metrology tools).

Ability to work non-standard hours, including rotational shifts, weekends, and holidays to support 24x7 operations.