Own the Lithography and Etch process engineering areas, ensuring seamless transitions from proof-of-concept to manufacturing, which is now underway.

Drive the wafer fab roadmap and deliver key performance indicators (KPIs) by overseeing process innovation, new tool installations, and process capability enhancements.

Utilize Statistical Process Control (SPC), Failure Mode and Effects Analysis (FMEA), and structured problem-solving (RCA) to eliminate systemic bottlenecks and enhance lithography and etch module stability.

Implement equipment and process optimization to maximize production efficiencies and optimize wafer output.

Serve as the primary technical liaison for fab operations, ensuring safety, quality, and manufacturability standards are consistently exceeded. Drive an engaged engineering culture through proactive performance management and talent development.

Master's degree in Electrical Engineering, Optics, Physics, Materials Science, a related technical field, or equivalent practical experience.

15 years of experience in semiconductor lithography and compound semiconductor etch process engineering in high-volume semiconductor wafer fab manufacturing.

10 years of technical leadership experience with or without direct reports in semiconductor wafer fabrication.

Experience in semiconductor optoelectronics devices and device fabrication.