Develop and implement strategies for high-volume manufacturing of SoC products, including troubleshooting, ATE test coverage optimization, Defective Parts Per Million (DPPM) reduction, power and performance assurance, and product data integration and correlation between system, ATE, and SLT.

Drive interactions with wafer Fabrications (fabs) and Outsourced Semiconductor Assembly and Test (OSATs), and own and drive checkpoints for the quality metrics.

Drive production through test program releases, volume data analytics, lot disposition, extended test time reduction, yield improvement, and Return Materials Authorization (RMA) management.

Own setup and maintenance of test, diagnosis, and yield analysis infrastructure, including RMA support.

Collaborate with cross-functional teams across the globe, including Automated Test Equipment (ATE) and System-Level Test (SLT) Test Engineering, Packaging, Supplier Management, and Operations, to build, deploy, and maintain a high-volume manufacturing screening solution.

Bachelor's degree in Electrical Engineering, Computer Engineering, Computer Science, a related field, or equivalent practical experience.

2 years of experience in Product or Yield Engineering.

2 years of experience with interpreting ATE data logs (V93K, UltraFLEX), physical failure analysis and yield improvement.