About the job

Be part of a team that pushes boundaries, developing custom silicon solutions that power the future of Google's direct-to-consumer products. You'll contribute to the innovation behind products loved by millions worldwide. Your expertise will shape the next generation of hardware experiences, delivering unparalleled performance, efficiency, and integration.

The Thermal Manufacturing Engineering team delivers cooling solutions for Google Cloud serving all of Google's functions and customers.

As a manufacturing engineer for thermal products, you will work on a variety of products representing cooling solutions for all of Google's compute hardware, including the largest liquid cooled compute fleet in the world, impacting all of Google's internal and external Cloud customers. Using a deep understanding of manufacturing processes such as machining, welding, brazing, stamping, assembly, and skiving, you will enable product design and development for next generation thermal solutions at scale. With a background in industrial engineering, you will not only qualify new processes and suppliers but you will also optimize production processes, lines, and vendors to help build better supply chains. With an understanding of design methods, tools, and requirements, you will assist in providing DFx feedback, tolerance stack analysis, and thermal design considerations to enable manufacturing, automation, and scalability.

The AI and Infrastructure team is redefining what’s possible. We empower Google customers with breakthrough capabilities and insights by delivering AI and Infrastructure at unparalleled scale, efficiency, reliability and velocity. Our customers include Googlers, Google Cloud customers, and billions of Google users worldwide.

We're the driving channel behind Google's groundbreaking innovations, empowering the development of our cutting-edge AI models, delivering unparalleled computing power to global services, and providing the essential platforms that enable developers to build the future. From software to hardware our teams are shaping the future of world-leading hyperscale computing, with key teams working on the development of our TPUs, Vertex AI for Google Cloud, Google Global Networking, Data Center operations, systems research, and much more.

The US base salary range for this full-time position is $138,000-$202,000 + bonus + equity + benefits. Our salary ranges are determined by role, level, and location. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific salary range for your preferred location during the hiring process.

Please note that the compensation details listed in US role postings reflect the base salary only, and do not include bonus, equity, or benefits. Learn more about benefits at Google.

Responsibilities

• Lead manufacturing strategy and Design for Excellence (DFX) initiatives for thermal assemblies, acting as the primary link between product development and operations.

• Manage supplier relationships as the technical lead, overseeing selection, qualification, cost optimization, and failure analysis throughout the product life cycle.

• Drive continuous improvement by applying lean tools, Statistical Process Control (SPC), and data analysis to optimize production lines and ensure process repeatability.

• Develop advanced solutions and automation opportunities to support high-volume manufacturing and prepare the supply chain for future product requirements.

• Facilitate concurrent engineering by collaborating with design partners on process changes, resolving quality issues, and enforcing best practices for documentation and change control.

Minimum qualifications

• Bachelor's degree in Mechanical Engineering, Industrial, Process, or Manufacturing Engineering, or a related discipline, or equivalent practical experience.

• 8 years of experience with product development for mechanical assemblies.

Preferred qualifications

• 3 years of experience with product development for thermal assemblies for electronic systems.

• Experience with technologies such as heat pipes, thermosyphons, vapor chambers, evaporator/condenser assemblies.

• Experience with operations and supply chain management, process and production line development for high volume manufacturing.

• Experience with welding, machining, brazing (furnace, vacuum), soldering, sintering, stamping, skiving, assembly, die casting, injection molding, leak detection, test design and product testing, quality control, equipment and fixture design.

• Experience in modeling via CAD (Creo) and Thermal Analysis (FloTHERM).

• Understanding of passive and active heatsink thermal transport mechanisms.