Own the fab process engineering areas, ensuring seamless transitions from proof-of-concept, pilot to full-scale production. Includes lithography, wet chemistry, dry etch, thin film deposition, epitaxy, and other wafer process processes and modules.

Guide the strategic wafer fab roadmap and deliver Key Performance Indicator (KPI) by overseeing process innovation, process automation, new tool installations and process capability enhancements.

Utilize Statistical Process Control (SPC), Failure Mode and Effect Analysis (FMEA) and structured problem-solving (root cause analysis) to eliminate systemic bottlenecks and enhance lithography and etch module stability.

Implement high volume wafer fab manufacturing best practice, equipment and process optimizations to maximize production efficiencies and optimize wafer output.

Act as the technical liaison for fab operations, ensuring all safety, quality, and manufacturability standards are surpassed. Cultivate an engaged, process engineering team through proactive performance management and strategic development.

Master of Science in Electrical Engineering, Materials Science, Optics, Physics or related fields.

15 years of experience in semiconductor optoelectronics devices and semiconductor wafer fab manufacturing.

10 years of experience in engineering management within a semiconductor wafer fabrication environment, and team leadership during a product ramp from incubation.

5 years of expertise across multiple areas listed, such as lithography, etch, clean, thin film, polish, thermal, grind, hybrid bond, singulation, or compound semiconductor epitaxy.