Contribute to overall system architecture from chip to chiller and make interdisciplinary tradeoffs to optimize Total Cost of Ownership (TCO) of overall compute infrastructure.

Develop thermal/mechanical/system designs from package to data center level optimizing for cost and efficiency while innovating for performance.

Design thermal management hardware including material selection, heat sinks, heat exchangers, air movers, pumps, and all supporting equipment.

Develop appropriate specifications and test procedures as necessary to ensure desired reliability and performance of electronic equipment, collaborate, supervise, mentor, and motivate suppliers to design and develop excellent products and mentor engineers in all aspects of concept development, analysis, design, and specification.

PhD degree in Mechanical Engineering, Product Design, or a related field.

Experience in any one domain of mechanical engineering through internships, academic research, or publications.

Experience in electronics packaging, server systems, data centers, or a related industry.

Experience with Computational Fluid Dynamics (CFD), thermal analysis techniques, pipe flow (pressure drop) calculations, and structural modeling techniques.