About the job

Our computational challenges are so big and unique we can't just buy our hardware, we've got to make it ourselves. Our Platforms team designs and builds the hardware, software and networking technologies that power all of Google's services. As a Mechanical Engineer, you will design and evaluate our data center systems, identifying product requirements and contributing to research and project planning. From the chip to chiller, you will be responsible for designing and optimizing an architecture that will scale with Google's continued growth. With your technical expertise, you will lead and manage projects, develop product and process improvements, provide consultation to others and help facilitate training and development.

As a Product Design Engineer, you will design and evaluate our server platforms and data center systems, identifying product requirements and contributing to research and project planning. From the chip to chiller, you will be responsible for designing and optimizing an architecture that will scale with Google's continued growth and innovation. With your technical expertise, you will conceive, lead and manage projects, develop product and process improvements, provide consultation to others and help facilitate training and development. You will develop and deliver excellent thermal systems, products, and advanced technologies with a focus on end-to-end, chip-to-chiller, infrastructure stack optimization and innovation opportunities, in collaboration with cross-functional partners.
The AI and Infrastructure team is redefining what’s possible. We empower Google customers with breakthrough capabilities and insights by delivering AI and Infrastructure at unparalleled scale, efficiency, reliability and velocity. Our customers include Googlers, Google Cloud customers, and billions of Google users worldwide.

We're the driving force behind Google's groundbreaking innovations, empowering the development of our AI models, delivering unparalleled computing power to global services, and providing the essential platforms that enable developers to build the future. From software to hardware our teams are shaping the future of world-leading hyperscale computing, with key teams working on the development of our TPUs, Vertex AI for Google Cloud, Google Global Networking, Data Center operations, systems research, and much more.

The US base salary range for this full-time position is $126,000-$181,000 + bonus + equity + benefits. Our salary ranges are determined by role, level, and location. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific salary range for your preferred location during the hiring process.

Please note that the compensation details listed in US role postings reflect the base salary only, and do not include bonus, equity, or benefits. Learn more about benefits at Google.

Responsibilities

• Contribute to overall system architecture from chip to chiller and make interdisciplinary tradeoffs to optimize Total Cost of Ownership (TCO) of overall compute infrastructure.

• Develop thermal/mechanical/system designs from package to data center level optimizing for cost and efficiency while innovating for performance.

• Design thermal management hardware including material selection, heat sinks, heat exchangers, air movers, pumps, and all supporting equipment.

• Develop appropriate specifications and test procedures as necessary to ensure desired reliability and performance of electronic equipment, collaborate, supervise, mentor, and motivate suppliers to design and develop excellent products and mentor engineers in all aspects of concept development, analysis, design, and specification.

Minimum qualifications

• PhD degree in Mechanical Engineering, Product Design, or a related field.

• Experience in any one domain of mechanical engineering through internships, academic research, or publications.

• Experience in electronics packaging, server systems, data centers, or a related industry.

• Experience with Computational Fluid Dynamics (CFD), thermal analysis techniques, pipe flow (pressure drop) calculations, and structural modeling techniques.

Preferred qualifications

• Experience in one or more advanced cooling techniques such as liquid cooling, thermal interface materials, thermo-electric devices, two-phase heat transfer or heat exchangers.

• Experience working with Original Equipment Manufacturer (OEM), Original Device Manufacturer (ODM), and cooling system and component suppliers.