About the job

The Raxium Facility and Equipment team maintains a broad range of semiconductor and facility equipment and cleanroom infrastructure. Our expertise lies in understanding the relationship between semiconductor processing and its support equipment, enabling us to troubleshoot problems, execute tasks and collaborate on installing, modifying, maintaining and repairing cleanroom and facility support equipment.

In this role, you will support our microLED and Augmented Reality development. You will maintain, support, and optimize semiconductor back-end processing equipment, including Bonding, CMP, Plating, and Grinding tools. You will utilize your experience in semiconductor manufacturing to support toolsets such as wafer bonder, planarization, electroplating, and singulation equipment. Responsibilities also include managing installations, troubleshooting issues, and implementing preventative maintenance to improve the reliability and performance of our equipment portfolio.

For decades, the computing revolution has reshaped our world driven by breakthroughs in compute, connectivity, mobile, and now, AI. Google's XR team is at the forefront of the next major leap – the convergence of AI and XR. This is more than just new devices – it's about reimagining how we interact with the world around us. We're building a future where lightweight XR devices pair with helpful AI to augment human intelligence, offering personalized, conversational, and contextually aware experiences.

The US base salary range for this full-time position is $144,000-$209,000 + bonus + equity + benefits. Our salary ranges are determined by role, level, and location. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific salary range for your preferred location during the hiring process.

Please note that the compensation details listed in US role postings reflect the base salary only, and do not include bonus, equity, or benefits. Learn more about benefits at Google.

Responsibilities

• Perform preventative and corrective maintenance on semiconductor manufacturing equipment, specializing in back-end processing (Wafer Bonding, Die-to-Wafer Bonding, Wafer Grinding, Singulation, Chemical Mechanical Polishing, and Electroplating).

• Leverage technical expertise and diagnostic skills to resolve complex equipment issues and implement solutions using schematics, diagrams, and specialized test equipment.

• Provide comprehensive support for critical semiconductor manufacturing systems to ensure high yields and maximum uptime across back-end wafer processing toolsets.

• Collaborate with engineering teams to manage equipment upgrades and new tool installations, ensuring seamless integration and optimal operational performance.

• Uphold safety protocols and foster a collaborative environment through cross-functional team support.

Minimum qualifications

• Bachelor’s degree in Electrical, Chemical, or Mechanical Engineering, a related technical field, or equivalent practical experience.

• 8 years of experience maintaining and troubleshooting semiconductor processing equipment (e.g., wafer bonders, wafer handling, ECPs, wafer grinders, metering pumps, etc.).

• Experience diagnosing and resolving hardware and software issues.

• Experience with semiconductor equipment processes and automation systems (e.g., PLCs, robotics, etc.).

Preferred qualifications

• Experience developing and delivering technical training programs, and creating detailed, accurate documentation for complex metrology systems.

• Experience working with specialized bonding techniques with the ability to integrate and optimize bonding tools within automated manufacturing environments.

• Ability to manage vendor partnerships and successfully lead equipment-related projects, ensuring timely and efficient outcomes.

• Ability to implement process improvements using data analysis to optimize equipment performance and reliability, with a proactive and investigative approach.