About the job

Our Platforms Infrastructure Engineering team designs and builds the hardware and software technologies that power all of Google's services. Our computational challenges are complex and unique, enabled by custom hardware designed and made in house. Our Mechanical Product Design Engineering team members work cross-functionally to design, build, and deploy the latest technology to support the needs of compute, storage, networking, and machine learning hardware.

As a Senior Mechanical Systems Engineer, you will lead projects to design and evaluate our IT/data center thermal systems, identifying product requirements and contributing to research and project planning. From the chip to the data center, you will be responsible for leading teams for designing and optimizing an architecture that will scale with Google's continued growth. With your technical expertise, you will lead and manage people and projects and develop product and process improvements.

The AI and Infrastructure team is redefining what’s possible. We empower Google customers with breakthrough capabilities and insights by delivering AI and Infrastructure at unparalleled scale, efficiency, reliability and velocity. Our customers include Googlers, Google Cloud customers, and billions of Google users worldwide.

We're the driving team behind Google's groundbreaking innovations, empowering the development of our cutting-edge AI models, delivering unparalleled computing power to global services, and providing the essential platforms that enable developers to build the future. From software to hardware our teams are shaping the future of world-leading hyperscale computing, with key teams working on the development of our TPUs, Vertex AI for Google Cloud, Google Global Networking, Data Center operations, systems research, and much more.

The US base salary range for this full-time position is $159,000-$231,000 + bonus + equity + benefits. Our salary ranges are determined by role, level, and location. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific salary range for your preferred location during the hiring process.

Please note that the compensation details listed in US role postings reflect the base salary only, and do not include bonus, equity, or benefits. Learn more about benefits at Google.

Responsibilities

• Act as a go-to technical leader with thermal knowledge of server, storage, and various IT equipment systems.

• Enable qualification of thermal products from concept design to final production and deployment. Collaborate with cross-functional leaders and external vendors/partners to maintain and improve design, development, and qualification processes.

• Contribute to overall system architecture from chip to chiller to optimize TCO of overall compute infrastructure. Develop holistic thermal designs/architectures from package to data center level, optimizing for cost and efficiency while innovating for performance.

• Design thermal management hardware including material selection, heat sinks, heat exchangers, air movers, pumps, systems, and end-to-end cooling systems.

• Develop appropriate specifications and test procedures to ensure desired reliability and performance of electronic equipment. Collaborate, supervise, mentor, and motivate internal and external teams to design and develop excellent products.

Minimum qualifications

• Bachelor's degree in Mechanical Engineering, Product Design, or related field, or equivalent practical experience.

• 5 years of experience leading technical teams with product development and technology development in thermals management.

Preferred qualifications

• Master's degree in Mechanical Engineering, Product Design, or related field, or equivalent practical experience.

• Experience in establishing project goals, coordinating resources, and providing technical leadership.

• Experience working with cooling strategies used for packages, boards, systems, and data centers.

• Experience in advanced cooling techniques such as liquid cooling, thermal interface materials, or heat exchangers.

• Experience working with OEM, ODM, and cooling system and component suppliers.

• Experience capturing temperature, pressure, velocity, power, flow rates, acceleration, displacement, sound, FloTHERM, Ice Pak, and CAD.