About the job

In this role, you’ll work to shape the future of AI/ML hardware acceleration. You will have an opportunity to drive cutting-edge TPU (Tensor Processing Unit) technology that powers Google's most demanding AI/ML applications. You’ll be part of a team that pushes boundaries, developing custom silicon solutions that power the future of Google's TPU. You'll contribute to the innovation behind products loved by millions worldwide, and leverage your design and verification expertise to verify complex digital designs, with a specific focus on TPU architecture and its integration within AI/ML-driven systems.

As an ASIC Physical Design Engineer, you will collaborate with RTL, Design for Testing (DFT), Floorplan, and full-chip Signoff teams. Additionally, you will solve technical problems with innovative micro-architecture and practical logic circuits solutions, while evaluating design options with optimized performance, power, and area in mind.

The AI and Infrastructure team is redefining what’s possible. We empower Google customers with breakthrough capabilities and insights by delivering AI and Infrastructure at unparalleled scale, efficiency, reliability and velocity. Our customers include Googlers, Google Cloud customers, and billions of Google users worldwide.

We're the driving force behind Google's groundbreaking innovations, empowering the development of our cutting-edge AI models, delivering unparalleled computing power to global services, and providing the essential platforms that enable developers to build the future. From software to hardware our teams are shaping the future of world-leading hyperscale computing, with key teams working on the development of our TPUs, Vertex AI for Google Cloud, Google Global Networking, Data Center operations, systems research, and much more.

The US base salary range for this full-time position is $163,000-$237,000 + bonus + equity + benefits. Our salary ranges are determined by role, level, and location. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific salary range for your preferred location during the hiring process.

Please note that the compensation details listed in US role postings reflect the base salary only, and do not include bonus, equity, or benefits. Learn more about benefits at Google.

Responsibilities

• Participate in the Physical Design of complex blocks.

• Contribute to the design and closure of the full chip and individual blocks from RTL-to-GDS.

• Collaborate with internal logic and internal and external teams to achieve the best Power/Performance Analysis (PPA). This includes conducting feasibility studies for new microarchitectures as well as optimizing runs for finished RTL.

Minimum qualifications

• Bachelor's degree in Electrical Engineering, Computer Engineering, Computer Science, or a related field, or equivalent practical experience.

• 7 years of experience with physical design (e.g. from RTL to GDSII, including key stages like floorplanning, place and route, and timing closure).

• Experience in Python, Tcl, or Perl scripting.

Preferred qualifications

• Experience working with external partners on Physical Design (PD) closure.

• Experience in Static Timing Analysis (STA), with an understanding of how to define timing corners, margins and derates.

• Experience with Synopsys/Cadence PnR tools.

• Experience with backend flows (e.g., LEC, PI/SI, DRC/LVS, etc.).

• Understanding of DFT including Scan, MBIST and LBIST.

• Understanding of performance, power and area (PPA) trade-offs.