About the job

As a CAD/PCB Design Engineer, you will be at the forefront of developing advanced boards for consumer electronics. Collaborating closely with Electrical and Mechanical Engineers, you will contribute throughout the entire product lifecycle, from initial PCB outline and component placement to complex routing. You will be requiring engagement with external fabricators and vendors to implement industry standards, tools, and technologies in our designs.

The Google Pixel team focuses on designing and delivering the world's most helpful mobile experience. The team works on shaping the future of Pixel devices and services through some of the most advanced designs, techniques, products, and experiences in consumer electronics. This includes bringing together the best of Google’s artificial intelligence, software, and hardware to build global smartphones and create transformative experiences for users across the world.

The US base salary range for this full-time position is $159,000-$231,000 + bonus + equity + benefits. Our salary ranges are determined by role, level, and location. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific salary range for your preferred location during the hiring process.

Please note that the compensation details listed in US role postings reflect the base salary only, and do not include bonus, equity, or benefits. Learn more about benefits at Google.

Responsibilities

• Drive the mechanical and electrical design of PCBs from initial concept through mass production, taking full ownership of one or multiple moderately complex projects.

• Apply expert knowledge of PCB design subdisciplines (e.g., SoC PDN, RF layout, high-speed routing) to optimize layouts for performance, SIPI, fabrication, DFM/DFA, and cost-effectiveness.

• Serve as a key subject-matter expert (SME) and interface between cross-functional teams (electrical engineers, mechanical engineers, product design, DFM/DFA) and fabrication vendors.

• Initiate and own research and development or new technology investigation (NTI) projects of medium to high complexity. Conduct thorough design reviews of placement, routing, and stackup, analyze PCB routing, DFM/DFA/DRC reports.

• Drive collaboration to establish precise impedance control rules, ensure adherence to DFM, DFA, and DFT guidelines, and suggest cost reduction solutions while maintaining electrical performance.

Minimum qualifications

• Bachelor's degree in Electrical Engineering, or a related field, or equivalent practical experience.

• 4 years of experience in both Printed Circuit Board (PCB) design and Flexible Printed Circuit (FPC) design, with experience using Computer-Aided Design (CAD) software tools.

• 4 years of experience utilizing cadence allegro tools, including use of allegro constraints manager for managing and implementing design rules.

Preferred qualifications

• Experience with PCB design tools and methodologies, with the foresight to anticipate and address future system issues and simplify/standardize existing solutions.

• Experience across all phases of hardware development.

• Knowledge of mechanical design outline formats and proven ability to act as a point of contact for cross-functional partners.

• Expertise in both FPC and rigid-flex layout techniques, showcasing versatility in various design challenges.

• Ability to execute complex, high-speed board designs (e.g., high-density Ball-Grid Array (BGA) packages, blind/buried vias).