Develop and execute strategies for ASIC/SoC new product introduction, planning, bring-up, verification, characterization, and qualification support.

Drive interactions with suppliers, wafer fabs and OSATs, own and drive checkpoints for key quality metrics.

Audit screening programs before releasing to production.

Setup and maintain test, diagnosis, and yield analysis infrastructure, including Return Material Authorization (RMA) support.

Collaborate with cross-functional teams across the globe including ATE test engineering, system level test, packaging, supply chain, and operations to ensure high production yield and high quality in-field operation.

Bachelor's degree in Electrical Engineering, Mechanical Engineering, Computer Engineering or Computer Science, with an emphasis on computer architecture.

4 years of experience in product engineering, yield engineering, or test engineering.

Experience with integrated circuit (IC) manufacturing (e.g., wafer processing, semiconductor packaging, or silicon testing).

Experience with test coverage, Automatic Test Equipment (ATE), or Defective Parts per Million (DPPM) reduction.

Experience in yield improvement and RMA.