Perform preventative and corrective maintenance on semiconductor manufacturing equipment, specializing in back-end processing (Wafer Bonding, Die-to-Wafer Bonding, Wafer Grinding, Singulation, Chemical Mechanical Polishing, and Electroplating).

Leverage technical expertise and diagnostic skills to resolve complex equipment issues and implement solutions using schematics, diagrams, and specialized test equipment.

Provide comprehensive support for critical semiconductor manufacturing systems to ensure high yields and maximum uptime across back-end wafer processing toolsets.

Collaborate with engineering teams to manage equipment upgrades and new tool installations, ensuring seamless integration and optimal operational performance.

Uphold safety protocols and foster a collaborative environment through cross-functional team support.

Bachelor’s degree in Electrical, Chemical, or Mechanical Engineering, a related technical field, or equivalent practical experience.

8 years of experience maintaining and troubleshooting semiconductor processing equipment (e.g., wafer bonders, wafer handling, ECPs, wafer grinders, metering pumps, etc.).

Experience diagnosing and resolving hardware and software issues.

Experience with semiconductor equipment processes and automation systems (e.g., PLCs, robotics, etc.).