About the job

Be part of a team that pushes boundaries, developing custom silicon solutions that power the future of Google's direct-to-consumer products. You'll contribute to the innovation behind products loved by millions worldwide. Your expertise will shape the next generation of hardware experiences, delivering unparalleled performance, efficiency, and integration.
As a SoC Product Engineer, you will design and build the systems that form the foundation of the world's largest and most powerful computing infrastructure. You will develop from the lowest levels of circuit design to large system design and see those systems all the way through to high-volume manufacturing and mission-mode operation. You will work to shape the machinery that goes into our data centers affecting Google users.

The AI and Infrastructure team is redefining what’s possible. We empower Google customers with breakthrough capabilities and insights by delivering AI and Infrastructure at unparalleled scale, efficiency, reliability and velocity. Our customers include Googlers, Google Cloud customers, and billions of Google users worldwide.

We're the driving force behind Google's groundbreaking innovations, empowering the development of our cutting-edge AI models, delivering unparalleled computing power to global services, and providing the essential platforms that enable developers to build the future. From software to hardware our teams are shaping the future of world-leading hyperscale computing, with key teams working on the development of our TPUs, Vertex AI for Google Cloud, Google Global Networking, Data Center operations, systems research, and much more.

Responsibilities

• Develop and implement strategies for high-volume manufacturing of SoC products, including troubleshooting, ATE test coverage optimization, Defective Parts Per Million (DPPM) reduction, power and performance assurance, and product data integration and correlation between system, ATE, and SLT.

• Drive interactions with wafer Fabrications (fabs) and Outsourced Semiconductor Assembly and Test (OSATs), and own and drive checkpoints for the quality metrics.

• Drive production through test program releases, volume data analytics, lot disposition, extended test time reduction, yield improvement, and Return Materials Authorization (RMA) management.

• Own setup and maintenance of test, diagnosis, and yield analysis infrastructure, including RMA support.

• Collaborate with cross-functional teams across the globe, including Automated Test Equipment (ATE) and System-Level Test (SLT) Test Engineering, Packaging, Supplier Management, and Operations, to build, deploy, and maintain a high-volume manufacturing screening solution.

Minimum qualifications

• Bachelor's degree in Electrical Engineering, Computer Engineering, Computer Science, a related field, or equivalent practical experience.

• 2 years of experience in Product or Yield Engineering.

• 2 years of experience with interpreting ATE data logs (V93K, UltraFLEX), physical failure analysis and yield improvement.

Preferred qualifications

• Master’s degree in Electrical Engineering, Computer Engineering, Computer Science, or a related field.

• 8 years of experience in product engineering, including test engineering.

• Experience evaluating customer returns with ATE and SLT, identifying coverage gaps, developing incremental structural and functional patterns to address quality issues.

• Experience in Python or Perl for data automation, statistical analysis (e.g., JMP), and yield management systems.

• Experience in leadership delivering screening solutions for the computing chips in advanced technology nodes with low DPPM.

• Knowledge of industry standards, design tools, and DFT best practices, including at-speed TDF, ATPG, MBIST, Memory Repair, diagnostic tools, yield improvement.