Advanced Packaging Engineer at GlobalFoundries

Аbout Global Foundries

GlobalFoundries (GF) is a leading full-service semiconductor foundry providing a unique combination of design, development, and fabrication services to some of the world’s most inspired technology companies. With a global manufacturing footprint spanning three continents, GF makes possible the technologies and systems that transform industries and give customers the power to shape their markets. For more information, visit www.gf.com.

Key Responsibilities:

The Advanced Packaging Engineer will lead the design, development, and integration of innovative co-packaged optics solutions, bridging the gap between Silicon Photonics (Si Ph) PICs (Photonic Integrated Circuits) and high-speed electrical ASICs. This role demands hands-on expertise in 2.5D/3D heterogeneous integration, fiber-to-chip coupling, and thermal/mechanical optimization to deliver production-ready next-generation optical engines.

• Package Architecture & Design: Define 2.5D/3D integration strategies for co-packaging, including TSV (Through-Silicon Via), RDL (Redistribution Layer), and hybrid bonding for Si Ph chiplet integration.
• Optical Coupling Solutions Development: Collaborate with cross functional teams on the design and assembly of fiber-to-chip coupling solutions to achieve low-loss optical interconnects.
• Process Integration: Develop and optimize packaging assembly flows (die-to-wafer/wafer-to-wafer) to ensure manufacturability (DfM) and reliability (DfR).
• Multiphysics Simulation: Perform thermal, mechanical (warpage), and opto-electronic simulations to validate designs.
• Root Cause Analysis: Perform failure analysis (FA) on high-speed electro-optical packages.

Required Qualifications:

• Education: Master's or PhD in Electrical Engineering, Materials Science, Applied Physics, or related field.
• Experience: 10+ years of experience in semiconductor packaging (2.5D/3D) with a specific focus on photonic or optoelectronic packaging.
• Software Proficiency: Familiarity with EDA tools (e.g., Cadence, Ansys for thermal / mechanical simulations), and scripting languages (Python) for test automation.
• Yield & Reliability: Experience with DOE (Design of Experiments), SPC (Statistical Process Control), FMEA (Failure Mode and Effects Analysis)

We Offer

• Base Salary
• Equity
• Annual Bonus Plan
• Medical Insurance

Information about our benefits you can find here: https://gf.com/careers/opportunities-in-europe/