채용
복지 및 혜택
•Healthcare
•401(k)
•Flexible Hours
필수 스킬
Linux
C
C++
Embedded Systems
Device Drivers
Qualcomm Snapdragon
ARM
JTAG
Android Automotive OS
SPI
UART
GPIO
The Company:
Faraday Future (FF) is a California-based mobility company, leveraging the latest technologies and world’s best talent to realize exciting new possibilities in mobility. We’re producing user-centric, technology-first vehicles to establish new paradigms in human-vehicle interaction. We’re not just seeking to change how our cars work – we’re seeking to change the way we drive. At FF, we’re creating something new, something connected, and something with a true global impact.
Your Role:
We are seeking an experienced Senior Linux BSP (Board Support Package) Engineer to lead the development and integration of a new hardware platform based on Qualcomm’s latest Snapdragon Automotive chipset. In this role, you will collaborate with our hardware vendor (who provides the initial Linux bring-up) and take ownership of extending, customizing, and validating the BSP for our specific vehicle configuration. You will enable key peripherals (Display, Camera, Ethernet, Serializer/Deserializer chipsets), integrate with Android Automotive OS, and ensure reliable communication with the vehicle’s on-board MCU for system power management and inter-processor communication. This is a senior-level, hands-on engineering position with significant influence on system architecture, debugging strategies, and technical direction.
*Responsibilities: *
Lead BSP Development & Board Bring-up:
-
Own the customization of the Linux BSP provided by the hardware vendor.
-
Guide peripheral bring-up and ensure robust hardware/software integration.
-
Mentor junior engineers in Linux kernel and driver development.
Peripheral Enablement & Integration:
-
Bring up and configure peripherals such as Display, Camera, Ethernet, Ser Des chipsets.
-
Develop, modify, and maintain Linux device drivers for custom hardware.
-
Validate integration with Android Automotive OS and ensure compliance with vehicle requirements.
MCU & Power Management Integration:
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Design and validate communication with the on-board MCU over SPI/UART/GPIO.
-
Support power-up, shutdown, suspend/resume sequencing between CPU and MCU.
-
Ensure reliability in real-world automotive scenarios.
Debugging & Validation:
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Perform in-depth kernel-level debugging using JTAG, serial console, oscilloscope, and logic analyzer.
-
Define and execute validation procedures for BSP and peripheral bring-up.
-
Collaborate cross-functionally with hardware vendors, Android application teams, and MCU firmware teams.
Basic Qualifications:
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Bachelor’s or Master’s degree in Electrical Engineering, Computer Engineering, or related field.
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7+ years of experience in embedded Linux BSP development.
-
Proven expertise in Linux kernel, device drivers, and board bring-up.
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Experience with peripheral bring-up: display (DSI), cameras (CSI), Ethernet, Ser Des
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Strong experience with Qualcomm Snapdragon So Cs (automotive or mobile) or other ARM-based So Cs.
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Proficiency in C/C++, Linux/Android build systems.
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Hands-on debugging experience with oscilloscope, logic analyzer, JTAG, and serial tools.
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Understanding of Android Automotive OS HALsand system integration.
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Strong analytical and problem-solving mindset for complex system-level challenges.
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Technical leadership with the ability to mentor and guide peers.
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Effective communicator for cross-functional collaboration and vendor engagement
Preferred Qualifications:
-
Experience with Qualcomm Automotive Development Platforms (ADP).
-
Knowledge of Linux/Android power management frameworks.
-
Prior work on inter-processor communication (SPI/UART/GPIO/I2C) between CPU and MCU.
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Familiarity with functional safety (ISO 26262), automotive-grade development, and OTA update frameworks.
-
Ability to provide technical leadership across software/hardware integration efforts.
Annual Salary Range:
($135,000 - $160,000 DOE), plus benefits and incentive plans
Perks + Benefits
-
Healthcare + dental + vision benefits (Free for you/discounted for family)
-
401(k) options
-
Casual dress code + relaxed work environment
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Culturally diverse, progressive atmosphere
Faraday Future is an equal opportunity employer and does not discriminate on the basis of race, national origin, gender, gender identity, sexual orientation, protected veteran status, disability, age, or other legally protected status.
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Faraday Future 소개

Faraday Future
PublicFaraday Future Inc. is an American technology company founded in 2014 focused on the development of electric vehicles. Based in Los Angeles, California, it began producing vehicles in 2023 and markets them in the United States and China. The company delivered a total of 16 vehicles by January 2025.
51-200
직원 수
Gardena
본사 위치
리뷰
2.7
10개 리뷰
워라밸
2.5
보상
2.3
문화
2.1
커리어
1.8
경영진
1.5
15%
친구에게 추천
장점
Good people and collaborative team
Challenging and interesting projects
Being part of EV/startup experience
단점
Poor management and leadership
Funding issues and layoffs
Lack of direction and transparency
연봉 정보
0개 데이터
Junior/L3
Junior/L3 · Solution Architect
0개 리포트
$169,150
총 연봉
기본급
-
주식
-
보너스
-
$143,778
$194,522
면접 경험
52개 면접
난이도
3.3
/ 5
소요 기간
14-28주
합격률
37%
경험
긍정 63%
보통 21%
부정 16%
면접 과정
1
Phone Screen
2
Technical Interview
3
Hiring Manager
4
Team Fit
자주 나오는 질문
Technical skills
Past experience
Team collaboration
Problem solving
뉴스 & 버즈
Faraday Future Announces $45 Million New Financing; Plans to Hold Annual Meeting of Stockholders on May 22 to Seek Approval of Key Proposals Designed to Accelerate EAI Strategy Execution and Protect Stockholder Interests
* The Company has secured $45 million in new debt financing commitments from an institutional investor. The promissory notes mature in two years after closing, and the promissory notes are redeemable following the six-month anniversary of closing under certain circumstances in either cash or shares of common stock based on the market price upon such redemption. The Company believes this represents the Company’s lowest-cost financing transaction for stockholders and investors in recent years and
·
3d ago
·
10
CA-FARADAY-FUTURE - Black Hills Pioneer
Black Hills Pioneer
News
·
3d ago
Faraday Future Announces $45 Million New Financing; Plans to Hold Annual Meeting of Stockholders on May 22 to Seek Approval of Key Proposals Designed to Accelerate EAI Strategy Execution and Protect Stockholder Interests - lincolnjournal.com
lincolnjournal.com
News
·
3d ago
Faraday Future Announces $45 Million New Financing; Plans to Hold Annual Meeting of Stockholders on May 22 to Seek Approval of Key Proposals Designed to Accelerate EAI Strategy Execution and Protect Stockholder Interests - Business Wire
Business Wire
News
·
3d ago