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职位Faraday Future

Senior Linux BSP Engineer

Faraday Future

Senior Linux BSP Engineer

Faraday Future

Gardena, California, United States

·

On-site

·

Full-time

·

1mo ago

薪酬

$135,000 - $160,000

福利待遇

Healthcare

401(k)

Flexible Hours

必备技能

Linux

C

C++

Embedded Systems

Device Drivers

Qualcomm Snapdragon

ARM

JTAG

Android Automotive OS

SPI

UART

GPIO

The Company:

Faraday Future (FF) is a California-based mobility company, leveraging the latest technologies and world’s best talent to realize exciting new possibilities in mobility. We’re producing user-centric, technology-first vehicles to establish new paradigms in human-vehicle interaction. We’re not just seeking to change how our cars work – we’re seeking to change the way we drive. At FF, we’re creating something new, something connected, and something with a true global impact.

Your Role:

We are seeking an experienced Senior Linux BSP (Board Support Package) Engineer to lead the development and integration of a new hardware platform based on Qualcomm’s latest Snapdragon Automotive chipset. In this role, you will collaborate with our hardware vendor (who provides the initial Linux bring-up) and take ownership of extending, customizing, and validating the BSP for our specific vehicle configuration. You will enable key peripherals (Display, Camera, Ethernet, Serializer/Deserializer chipsets), integrate with Android Automotive OS, and ensure reliable communication with the vehicle’s on-board MCU for system power management and inter-processor communication. This is a senior-level, hands-on engineering position with significant influence on system architecture, debugging strategies, and technical direction.

*Responsibilities: *

Lead BSP Development & Board Bring-up:

  • Own the customization of the Linux BSP provided by the hardware vendor.

  • Guide peripheral bring-up and ensure robust hardware/software integration.

  • Mentor junior engineers in Linux kernel and driver development.

Peripheral Enablement & Integration:

  • Bring up and configure peripherals such as Display, Camera, Ethernet, Ser Des chipsets.

  • Develop, modify, and maintain Linux device drivers for custom hardware.

  • Validate integration with Android Automotive OS and ensure compliance with vehicle requirements.

MCU & Power Management Integration:

  • Design and validate communication with the on-board MCU over SPI/UART/GPIO.

  • Support power-up, shutdown, suspend/resume sequencing between CPU and MCU.

  • Ensure reliability in real-world automotive scenarios.

Debugging & Validation:

  • Perform in-depth kernel-level debugging using JTAG, serial console, oscilloscope, and logic analyzer.

  • Define and execute validation procedures for BSP and peripheral bring-up.

  • Collaborate cross-functionally with hardware vendors, Android application teams, and MCU firmware teams.

Basic Qualifications:

  • Bachelor’s or Master’s degree in Electrical Engineering, Computer Engineering, or related field.

  • 7+ years of experience in embedded Linux BSP development.

  • Proven expertise in Linux kernel, device drivers, and board bring-up.

  • Experience with peripheral bring-up: display (DSI), cameras (CSI), Ethernet, Ser Des

  • Strong experience with Qualcomm Snapdragon So Cs (automotive or mobile) or other ARM-based So Cs.

  • Proficiency in C/C++, Linux/Android build systems.

  • Hands-on debugging experience with oscilloscope, logic analyzer, JTAG, and serial tools.

  • Understanding of Android Automotive OS HALsand system integration.

  • Strong analytical and problem-solving mindset for complex system-level challenges.

  • Technical leadership with the ability to mentor and guide peers.

  • Effective communicator for cross-functional collaboration and vendor engagement

Preferred Qualifications:

  • Experience with Qualcomm Automotive Development Platforms (ADP).

  • Knowledge of Linux/Android power management frameworks.

  • Prior work on inter-processor communication (SPI/UART/GPIO/I2C) between CPU and MCU.

  • Familiarity with functional safety (ISO 26262), automotive-grade development, and OTA update frameworks.

  • Ability to provide technical leadership across software/hardware integration efforts.

Annual Salary Range:

($135,000 - $160,000 DOE), plus benefits and incentive plans

Perks + Benefits

  • Healthcare + dental + vision benefits (Free for you/discounted for family)

  • 401(k) options

  • Casual dress code + relaxed work environment

  • Culturally diverse, progressive atmosphere

Faraday Future is an equal opportunity employer and does not discriminate on the basis of race, national origin, gender, gender identity, sexual orientation, protected veteran status, disability, age, or other legally protected status.

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关于Faraday Future

Faraday Future

Faraday Future Inc. is an American technology company founded in 2014 focused on the development of electric vehicles. Based in Los Angeles, California, it began producing vehicles in 2023 and markets them in the United States and China. The company delivered a total of 16 vehicles by January 2025.

51-200

员工数

Gardena

总部位置

评价

2.7

10条评价

工作生活平衡

2.5

薪酬

2.3

企业文化

2.1

职业发展

1.8

管理层

1.5

15%

推荐给朋友

优点

Good people and collaborative team

Challenging and interesting projects

Being part of EV/startup experience

缺点

Poor management and leadership

Funding issues and layoffs

Lack of direction and transparency

薪资范围

0个数据点

Junior/L3

Junior/L3 · Solution Architect

0份报告

$169,150

年薪总额

基本工资

-

股票

-

奖金

-

$143,778

$194,522

面试经验

52次面试

难度

3.3

/ 5

时长

14-28周

录用率

37%

体验

正面 63%

中性 21%

负面 16%

面试流程

1

Phone Screen

2

Technical Interview

3

Hiring Manager

4

Team Fit

常见问题

Technical skills

Past experience

Team collaboration

Problem solving