Cisco is seeking a Silicon Photonics Packaging Engineer to join the Packaging Technology & Quality team within our world-class Global Supply Chain. You will drive packaging technology development and qualification for Cisco’s cutting-edge silicon photonic products.

Your Impact

You will operate at the intersection of advanced technology and strategic execution, working within a highly collaborative and cross-functional environment. You will engage directly with counterparts at OSATs, contract manufacturers and other key suppliers driving package technology development from early-stage thru qualification as well as influence commodity strategy at a global scale.

This role offers cross-organizational visibility, and the potential to shape critical technology development and influence long-term product platforms. Key responsibilities:

• Serve as a technology development engineer in advanced packaging technology (2.5D/3D, TSV, MCM, flip-chip, heterogenous integration). Oversee various aspects such as wafer bumping, die prep, package assembly, reliability qualification, materials evaluation and testing.

• Work with top-tier package assembly partners to develop and qualify packaging solutions for Cisco products.

• Identify and mitigate risks, and resolve highly complex packaging issues. Drive and support quality initiatives such as failure analysis (FA), root cause finding, and implementation of corrective actions.

• Provide guidance on Design for Manufacturability/Reliability (DfM, DfR) contributing to the definition of critical parameters for HVM.

Minimum Qualifications

• MS in Mechanical Engineering, Electrical Engineering, Materials Science, Physics or a related field

5+ years of progressive industrial experience in packaging processes and assembly, with a demonstrable track record successful project execution.

• Comprehensive knowledge of packaging processes (wirebonding, die attach, bumping, flip-chip bonding, fanout, MCM, SMTA) and materials

• Expertise in advanced problem-solving methodologies (e.g. 8D, FMEA, statistical process control) and data analysis skills

Knowledge and experience in physical failure analysis methods

Preferred Qualifications:

• Experience with volume manufacturing Knowhow of substrate and PCB design and materials, and their influence on packaging

• Familiar with advanced finite element analysis methods for package design

• Ability to work within highly cross-functional and geographically distributed technical teams.

• Familiarity or experience with co-packaged optics is a plus

Why Cisco?

At Cisco, we’re revolutionizing how data and infrastructure connect and protect organizations in the AI era – and beyond. We’ve been innovating fearlessly for 40 years to create solutions that power how humans and technology work together across the physical and digital worlds. These solutions provide customers with unparalleled security, visibility, and insights across the entire digital footprint.

Fueled by the depth and breadth of our technology, we experiment and create meaningful solutions. Add to that our worldwide network of doers and experts, and you’ll see that the opportunities to grow and build are limitless. We work as a team, collaborating with empathy to make really big things happen on a global scale. Because our solutions are everywhere, our impact is everywhere.

We are Cisco, and our power starts with you.