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Ciena
Ciena

Telecommunications networking equipment company

Chip Engineering Lead / Manager

RoleEngineering
LevelLead
LocationOttawa
WorkOn-site
TypeFull-time
Posted1 month ago
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Required skills

Project Management

As the global leader in high-speed connectivity, Ciena is committed to a people-first approach. Our teams enjoy a culture focused on prioritizing a flexible work environment that empowers individual growth, well-being, and belonging. We’re a technology company that leads with our humanity—driving our business priorities alongside meaningful social, community, and societal impact.

About the Opportunity

We’re looking for a dynamic engineering leader to guide our Chip Engineering team within the Photonic Integrated Circuit (PIC) organization. This role is ideal for a seasoned product engineer ready to step into leadership, or an established manager seeking a new experience in a cutting-edge photonics environment. The position blends hands‑on technical work with team leadership and strategic decision‑making, and we will tailor responsibilities to the strengths of the successful candidate.

You’ll join a collaborative, tightly knit group focused on developing and scaling advanced photonic chip technologies. Our team supports a vertically integrated internal customer base and plays a central role in new product introduction, reliability engineering, and continuous improvement. While our core expertise is indium phosphide (InP) photonics for coherent communications, we are actively expanding into new material systems and integration platforms.

What You’ll Do

  • Lead, mentor, develop and potentially expand a four‑person team (including yourself) responsible for R&D product engineering and reliability.
  • Manage relationships with external supply partners, including statements of work, budgeting, planning, and material logistics.
  • Drive yield improvement and cost reduction from received die through finished die on sub-mount, across both production and new product introduction.
  • Establish and maintain factory work instructions; support process transfer from R&D to production; ensure Agile documentation and ISO compliance.
  • Oversee foundry process variations, up‑revisions, and change management activities.
  • Apply knowledge of InP foundry processes—such as wafer thinning, cleaving, facet coating, and automated visual inspection—to guide development and troubleshooting.
  • Provide first‑line technical support for issues arising at external manufacturing partners, engaging internal experts when needed.
  • Support project management activities depending on organizational priorities.
  • Collaborate closely with chip designers, hardware and product engineers, and commercial supply chain teams to ensure smooth product lifecycle execution.

What You Bring

  • Strong analytical skills, including data mining, normalization, and statistical analysis for manufacturing environments.
  • Deep understanding of chip‑level reliability principles and relevant industry standards.
  • Proficiency with project and product management tools such as Agile workflows, Gantt charts, yield Paretos, and correlation analysis.
  • Knowledge of foundry and backend processes, ideally in InP photonics and/or silicon or silicon nitride photonics.
  • Ability and willingness to travel internationally (including Asia) for 1–2 weeks at a time, up to four times per year.

Qualifications

  • Bachelor’s degree in engineering or a related scientific field required; graduate degree preferred.
  • At least 10 years of industry experience in product engineering, quality, and reliability for photonic chip technologies.

Pay Range: The annual salary range for this position is $115,900 - $185,100

Pay ranges at Ciena are designed to accommodate variations in knowledge, skills, experience, market conditions, and locations, reflecting our diverse products, industries, and lines of business. Please note that the pay range information provided in this posting pertains specifically to the primary location, which is the top location listed in case multiple locations are available.

Non-Sales employees may be eligible for a discretionary incentive bonus, while Sales employees may be eligible for a sales commission. In addition to competitive compensation, Ciena offers a comprehensive benefits package, including medical, dental, and vision plans, participation in 401(K) (USA) & DCPP (Canada) with company matching, Employee Stock Purchase Program (ESPP), Employee Assistance Program (EAP), company-paid holidays, paid sick leave, and vacation time. We also comply with all applicable laws regarding Paid Family Leave and other leaves of absence.

At Ciena, we are committed to building and fostering an environment in which our employees feel respected, valued, and heard. Ciena values the diversity of its workforce and respects its employees as individuals. We do not tolerate any form of discrimination.

Ciena is an Equal Opportunity Employer, including disability and protected veteran status.

If contacted in relation to a job opportunity, please advise Ciena of any accommodation measures you may require.

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About Ciena

Ciena

Ciena

Series C

Ciena Corporation is an American optical networking systems and software company based in Hanover, Maryland. The company has been described as a vital player in optical connectivity. The company reported revenues of $4.8 billion and more than 9,000 employees, as of November 2025.

5,001-10,000

Employees

Linthicum Heights

Headquarters

$3.2B

Valuation

Reviews

10 reviews

3.8

10 reviews

Work-life balance

3.5

Compensation

2.8

Culture

4.1

Career

3.2

Management

2.9

72%

Recommend to a friend

Pros

Flexible hours/schedule

Good benefits/health benefits

Supportive management/colleagues

Cons

Limited career advancement

Low pay/below industry average salary

High workload/long hours

Salary Ranges

76 data points

Mid/L4

Senior/L5

Mid/L4 · Lead, Data Engineering

1 reports

$206,590

total per year

Base

$158,915

Stock

-

Bonus

-

$206,590

$206,590

Interview experience

1 interviews

Difficulty

3.0

/ 5

Duration

14-28 weeks

Interview process

1

Application Review

2

Recruiter Screen

3

Technical Phone Screen

4

Onsite/Virtual Interviews

5

Team Matching

6

Offer

Common questions

Coding/Algorithm

Technical Knowledge

Behavioral/STAR

Past Experience

Culture Fit