At Cadence, we hire and develop leaders and innovators who want to make an impact on the world of technology.Role Summary

We are looking for an experienced Sr. Principal Analog Design Engineer to drive the design and delivery of high‑speed interface IPs, with a strong emphasis on Die‑to‑Die (D2D) interconnects based on the UCIe standard and advanced package technologies. The role requires hands‑on ownership from architecture through silicon bring‑up, working closely with layout, verification, package, and system teams.

Key Responsibilities

• Architect, design, and deliver high‑speed analog / mixed‑signal circuits for Die‑to‑Die and chiplet‑based systems, including UCIe‑compliant interfaces.
• Own analog blocks for high‑speed interfaces such as clocking, TX/RX front‑ends, termination schemes, biasing, and equalization support circuits.
• Drive architecture definition, feasibility analysis, and design trade‑offs considering signal integrity, power, noise, and packaging parasitics.
• Perform schematic design, simulation, and optimization across PVT corners using industry‑standard EDA tools.
• Work closely with advanced package teams (2.5D / 3D, interposers, organic substrates) to co‑optimize circuit and package design.
• Support layout reviews, parasitic extraction analysis, and post‑layout sign‑off for high‑speed performance.
• Collaborate with AMS verification, digital, and system teams to enable full‑chip integration and validation.
• Participate in silicon bring‑up, debug, and characterization, including correlation with simulation results.
• Contribute to design methodology, checklists, and best practices for high‑speed analog and D2D designs.

Required Qualifications

• Bachelor’s or Master’s degree in Electrical / Electronics Engineering or related field.
• 12+ years of hands‑on experience in analog / mixed‑signal IC design.
• Strong experience with high‑speed interface design (e.g., DDR, PCIe, Ser Des, Die‑to‑Die links).
• Solid understanding of UCIe standard concepts, D2D PHY requirements, and chiplet architectures.
• Experience working with advanced packaging technologies and understanding package‑induced effects on high‑speed signaling.
• Proficiency in schematic‑level design, simulation, and debug across PVT corners.
• Strong fundamentals in analog circuit theory, signal integrity, noise analysis, and clocking.

Preferred / Nice‑to‑Have Skills

• Direct hands‑on experience with UCIe PHY design or integration.
• Exposure to AMS verification flows and mixed‑signal simulation environments.
• Experience with post‑silicon debug and correlation.
• Knowledge of power integrity, thermal considerations, and package‑aware design flows.
• Ability to mentor junior engineers and lead technical discussions.

What Success Looks Like

• Robust, scalable UCIe / D2D analog IPs meeting performance, power, and reliability targets.
• Smooth collaboration across design, verification, and packaging teams.
• Predictable execution aligned with project milestones and KPIs / OKRs.
• Strong ownership mindset from architecture to silicon.

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