At Cadence, we hire and develop leaders and innovators who want to make an impact on the world of technology.Key Responsibilities1.

Business Development & IP Sales:

• Drive IP licensing growth in China, with a strong focus on Tensilica DSP and CPU technologies.
• Engage with SoC teams in automotive, AR/VR, mobile, smart speakers, TWS, and broader consumer markets.
• Identify and qualify new business opportunities, expand existing accounts, and manage the full sales cycle.
• Understand customer architecture requirements, future roadmaps, and competitive offerings to position Tensilica IP effectively.
• Work closely with China sales teams to develop and execute regional account strategies.

2. Software Partner Ecosystem Management

• Build, develop, and nurture relationships with key software vendors, including:
• AI/ML algorithm developers
• Audio/voice/ANC/beamforming software vendors
• Vision and XR software developers
• Automotive middleware and safety‑related software providers

Advocate Tensilica DSPs by driving:

• Partner onboarding
• Technical enablement
• Performance optimization
• Joint solution and reference design development
• Expand the breadth of use cases supported on Tensilica DSPs, including:
• AI inferencing
• Audio/voice processing
• Sensor fusion
• XR/AR acceleration
• Always‑on, low‑power workloads

3. Collaboration with China Sales & FAE Teams

• Work hand‑in‑hand with the China sales organization to coordinate account strategies and engagement plans.
• Partner closely with FAE teams to:
• Support technical evaluations
• Manage benchmarking activities
• Drive proof‑of‑concept engagements
• Resolve technical blockers that influence purchasing decisions
• Provide feedback from customers and partners to guide product planning and roadmap decisions.

4. Market Intelligence & Strategic Planning

• Develop China‑specific go‑to‑market strategies for automotive and consumer segments.
• Monitor industry trends, emerging workloads, regulatory standards, and local ecosystem shifts (software and hardware).
• Represent the company at China industry conferences, partner workshops, customer summits, and semiconductor forums.

Qualifications Required

• Bachelor’s or Master’s in Electrical Engineering, Computer Engineering, or related discipline.
• 10+ years of experience in semiconductor IP, DSP/CPU/NPU technologies, SoC design, embedded software, or related business development roles.
• Strong technical understanding of DSP architectures, signal processing, embedded systems, and AI workloads.
• Proven success selling semiconductor IP or building technical business engagements in China.
• Familiarity with software ecosystems in audio, voice, AI/ML, AR/VR, and automotive domains.
• Excellent communication, negotiation, and relationship‑building skills.
• Ability to travel within China and internationally.

Preferred

• Direct experience with Tensilica DSPs or similar configurable DSP architectures.
• Existing relationships with:
• China automotive SoC vendors
• Smartphone/IoT/CE chipmakers
• AR/VR and edge‑AI solution developers
• Leading software algorithm partners
• Understanding of heterogeneous compute architectures, low‑power SoC design, or automotive functional safety (e.g., ISO26262).

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