招聘
福利待遇
•Healthcare
•401(k)
•Equity
•Mental Health
必备技能
Semiconductor Reliability Engineering
RF Characterization
ESD Testing
HTOL Testing
Thermal Testing
Failure Analysis
Root Cause Analysis
Electrical Analysis
Test Design
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Job Description:
Senior Reliability Engineer, RF Characterization and Reliability
Overview
We are seeking a highly skilled and motivated Senior Reliability Engineer 3 to join our team, focusing on the radio frequency (RF) characterization and reliability test development for our cutting-edge 'Tuner Switch' products used in wireless handset chipsets. This critical function serves as a reliability expert and partner to our Research & Development (R&D), Design, and Quality teams. The ideal candidate will possess deep expertise in semiconductor device physics and reliability principles, particularly in RF and power electronics, and will be instrumental in ensuring the long-term performance and robustness of our products.
Responsibilities
The Senior Reliability Engineer will be responsible for defining, executing, and analyzing a combination of electrical, thermal, and mechanical stress tests to ensure the long-term performance and reliability of 'Tuner switch' and related devices fabricated in RF CMOS technology.
Key areas of focus include:
-
RF Characterization:- Developing and executing test plans to assess the switch device's performance across various operating frequencies, power levels, and environmental conditions.
-
Evaluating performance stability over extended stress periods.
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Wafer Level RF Testing:- Establishing and implementing procedures for performing critical RF reliability and performance tests early in the manufacturing process at the wafer level.
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ESD (Electrostatic Discharge) Characterization:- Designing and conducting ESD robustness tests (e.g., HBM, MM, CDM) to characterize the device's immunity to electrical stress events, a critical failure mechanism.
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Power Handling Characterization:- Assessing and validating the device's ability to reliably manage and sustain the high-power levels encountered in typical mobile tuner applications.
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Thermal IR Characterization:- Utilizing advanced instruments like QFI (Quantum Focus Instruments) or similar IR thermal imaging equipment to monitor heat distribution and hot thermal spots, ensuring the device operates within safe thermal limits under various stress conditions.
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Intrinsic Device Reliability Characterization:- Developing and executing tests to assess the long-term reliability of the underlying semiconductor IC process and package technologies used to construct the tuner switch.
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Advanced Life Testing:- Familiarity and direct experience with advanced life testing methodologies such as RF High-Temperature Operating Life (RF HTOL) and DC HTOL.
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Failure Analysis & Root Cause:- Leading troubleshooting efforts, conducting root cause analysis, and coordinating failure analysis activities with internal and external labs to drive continuous improvement in design and manufacturing processes.
Qualifications
Minimum Qualifications
- Degree in Electrical Engineering, Materials Science, or a related field. Bachelors and 5 years of related experience or Master’s degree and 3 years of related experience or PhD and no experience and valid visa to work in the US .
- Minimum of 5 years of experience in semiconductor device reliability engineering, with a focus on RF or power conversion components.
- Proven experience in designing and executing reliability stress tests, including ESD, HTOL, and thermal testing.
- Strong analytical skills with the ability to interpret complex electrical and physical failure data.
Preferred Qualifications
- Direct experience with RF test equipment and measurement techniques (e.g., VNAs, power meters, spectrum analyzers).
- Expertise in RF/microwave semiconductor devices, preferably those used in wireless handsets (e.g., switches, filters, front-end modules).
- Familiarity with industry-standard reliability specifications and qualifications (e.g., JEDEC).
- Proficiency in statistical analysis tools (e.g., JMP, Minitab) for reliability data.
Additional Job Description: Compensation and Benefits
The annual base salary range for this position is $101,000 - $162,000
This position is also eligible for a discretionary annual bonus in accordance with relevant plan documents, and equity in accordance with equity plan documents and equity award agreements.
Broadcom offers a competitive and comprehensive benefits package: Medical, dental and vision plans, 401(K) participation including company matching, Employee Stock Purchase Program (ESPP), Employee Assistance Program (EAP), company paid holidays, paid sick leave and vacation time. The company follows all applicable laws for Paid Family Leave and other leaves of absence.
Broadcom is proud to be an equal opportunity employer. We will consider qualified applicants without regard to race, color, creed, religion, sex, sexual orientation, national origin, citizenship, disability status, medical condition, pregnancy, protected veteran status or any other characteristic protected by federal, state, or local law. We will also consider qualified applicants with arrest and conviction records consistent with local law.If you are located outside USA, please be sure to fill out a home address as this will be used for future correspondence.
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关于Broadcom

Broadcom
AcquiredBroadcom Corporation was an American fabless semiconductor company that made products for the wireless and broadband communication industry. It was acquired by Avago Technologies for $37 billion in 2016 and currently operates as a wholly owned subsidiary of the merged entity Broadcom Inc.
10,001+
员工数
Palo Alto
总部位置
评价
3.7
10条评价
工作生活平衡
3.2
薪酬
3.8
企业文化
3.5
职业发展
2.8
管理层
2.3
65%
推荐给朋友
优点
Good benefits and competitive compensation
Flexible work arrangements and remote options
Supportive team environment
缺点
Management issues and lack of direction
Limited career advancement opportunities
High pressure and stressful work environment
薪资范围
360个数据点
Junior/L3
Senior/L5
Junior/L3 · Data Scientist ICB 2
0份报告
$156,500
年薪总额
基本工资
-
股票
-
奖金
-
$133,025
$179,975
面试经验
2次面试
难度
4.0
/ 5
时长
14-28周
体验
正面 0%
中性 50%
负面 50%
面试流程
1
Application Review
2
Recruiter Screen
3
Technical Phone Screen
4
Onsite/Virtual Interviews
5
Team Matching
6
Offer
常见问题
Coding/Algorithm
System Design
Behavioral/STAR
Technical Knowledge
Past Experience
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