招聘
福利待遇
•Healthcare
•401(k)
•Equity
•Unlimited Pto
必备技能
SOI RF circuits development
EM simulation
RF module integration design
SOI transistor modeling
High power SOI switch design
CMOS RFIC design
Analog design
Digital design
ESD circuits design
SOI transistor level layouts
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Job Description:
Responsibilities:
Design SOI RFICs for 4G/5G smart phone integrated RF Front-end (RFFE) Modules.
Design RF blocks and matching circuits on SOI die and PCB having compact form factor layouts handling high power.
Generation of innovations IPs on new RF circuits and new RF systems to improve module performances and cost factors.
Development of new conceptual design to successful volume productions by improving and optimizing transistor level and PCB level circuits.
Management and development of the SOI layouts and the PCB layouts.
Presenting the design details and technology evaluations among various development teams.
Skills and Experiences:
Independent, self-started team player willing to thrive under dynamic working environments.
Ability to manage multiple concurrent projects under short timelines.
Solid SOI RF circuits’ development experiences with proven successful production delivery records, including 4G/5G high power switches, couplers and attenuators and etc.
Solid EM simulation skills and RF module integration design experiences on small factor PCBs.
Solid experiences of SOI transistors models on both small signal and large signal.
Excellent design and debug experiences of high power SOI switches using various simulation tools on source pulling, load pulling, power matching, harmonics, ruggedness and reliability.
Good experiences of integration of SOI circuits with PAs, LNAs and filters on a compact module PCB are plus.
Hand on experiences with lab instruments such as Spectrum analyzer and Network analyzer.
Familiar with CMOS RFIC design, analog design and digital design.
Familiar with ESD circuits design of digital IOs, analog IOs and RF IOs.
Familiar with RFIC design flows and simulation tools, including Sprectre, Golden Gate, AMS, ADS and etc.
Familiar with SOI transistor level layouts and extractions.
Familiar with 2D and 3D EM tools, such as HFSS, EMX and Momentum.
PhD’s degree or Master’s degree in electrical engineering with 6 years of direct design/devolvement industrial experiences.
Additional Job Description: Compensation and Benefits
The annual base salary range for this position is $120,000 - $192,000
This position is also eligible for a discretionary annual bonus in accordance with relevant plan documents, and equity in accordance with equity plan documents and equity award agreements.
Broadcom offers a competitive and comprehensive benefits package: Medical, dental and vision plans, 401(K) participation including company matching, Employee Stock Purchase Program (ESPP), Employee Assistance Program (EAP), company paid holidays, paid sick leave and vacation time. The company follows all applicable laws for Paid Family Leave and other leaves of absence.
Broadcom is proud to be an equal opportunity employer. We will consider qualified applicants without regard to race, color, creed, religion, sex, sexual orientation, national origin, citizenship, disability status, medical condition, pregnancy, protected veteran status or any other characteristic protected by federal, state, or local law. We will also consider qualified applicants with arrest and conviction records consistent with local law.If you are located outside USA, please be sure to fill out a home address as this will be used for future correspondence.
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关于Broadcom

Broadcom
AcquiredBroadcom Corporation was an American fabless semiconductor company that made products for the wireless and broadband communication industry. It was acquired by Avago Technologies for $37 billion in 2016 and currently operates as a wholly owned subsidiary of the merged entity Broadcom Inc.
10,001+
员工数
Palo Alto
总部位置
评价
3.7
10条评价
工作生活平衡
3.2
薪酬
3.8
企业文化
3.5
职业发展
2.8
管理层
2.3
65%
推荐给朋友
优点
Good benefits and competitive compensation
Flexible work arrangements and remote options
Supportive team environment
缺点
Management issues and lack of direction
Limited career advancement opportunities
High pressure and stressful work environment
薪资范围
360个数据点
Junior/L3
Senior/L5
Junior/L3 · Data Scientist ICB 2
0份报告
$156,500
年薪总额
基本工资
-
股票
-
奖金
-
$133,025
$179,975
面试经验
2次面试
难度
4.0
/ 5
时长
14-28周
体验
正面 0%
中性 50%
负面 50%
面试流程
1
Application Review
2
Recruiter Screen
3
Technical Phone Screen
4
Onsite/Virtual Interviews
5
Team Matching
6
Offer
常见问题
Coding/Algorithm
System Design
Behavioral/STAR
Technical Knowledge
Past Experience
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