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Job Description:

Job Summary

• Owns the end-to-end facet coating process for laser devices, characterization, driving productivity, yield, quality, and reliability across internal lines and subcontractor facilities. This role manages capacity expansion through the buyoff and qualification of new coaters while ensuring a seamless transition from R&D to high-volume manufacturing (HVM). You will serve as the technical authority for coatings, monitoring subcontractor operations to ensure shipment commitments are met.

Key Responsibilities

• Lead the technical management and decision making for facet coating and related backend operations, including wafer scribing, laser bar handling, and Automated Visual Inspection (AVI).
• Manage subcontractor manufacturers across different regions, implementing remote monitoring to ensure consistent performance across all coating processes.
• Lead the buyoff and qualification of new coating systems to support production scaling, collaborating closely with Product, Quality, and R&D teams.
• Drive New Process Integration (NPI) and formal process transfers from the design phase to high-volume manufacturing.
• Optimize batch sizes "load-lock" cycling, fixtures density to maximize output without compromising quality
• Perform deep-dive root cause analysis and implement robust Corrective and Preventive Actions (CAPA) for any process excursions and eliminate sources of defects.
• Define comprehensive process control plans, Statistical Process Control (SPC) strategies, FMEA and Out-of-Control Action Plan (OCAP) execution.
• Partner with equipment, integration, quality, and R&D teams, as well as external foundries, to align technical goals and operational strategies.
• Utilize statistical data analysis to identify yield detractors coating, thickness, defects, Equipment utilizations and operations efficiency.
• Establish dashboards and KPIs to track the health of facet coating processes; monitor daily performance, Cycle time and flag critical issues immediately. Summarise periodical reports to management
• Create and maintain Standard Operating Procedures (SOPs), technical reports, change management documents, and data analysis for all facet-coating related backend processes.
• Lowering the cost-per-die through process efficiency and recipe optimization

Qualifications

• Bachelor’s or Master’s in Engineering (Physics, Materials Science, Optical, or Electrical Engineering).
• 5–10 years of experience in semiconductor wafer fab or backend processes, with at least 3 years specialized in Thin Film Coating or Sputtering.
• Understanding of vacuum physics and deposition techniques (IBS), dielectric coating materials.
• Strong statics fundamentals and knowledge of SPC, DOE, FMEA, DMAIC, and advanced statistical tools such as JMP, visualization tools such as Tableau, SQL
• Practical understanding of wafer scribing, Pick-and-Place (PnP), AVI tools, Burn-in and fundamental mechanical engineering concepts.
• Knowledge laser manufacturing principles.
• Energetic leader with excellent interpersonal skills, Presentation skills; ability to remain resilient and adapt in high-stress, fast-paced environments.
• Minimum programming skills for data analysis and reporting

Broadcom is proud to be an equal opportunity employer. We will consider qualified applicants without regard to race, color, creed, religion, sex, sexual orientation, national origin, citizenship, disability status, medical condition, pregnancy, protected veteran status or any other characteristic protected by federal, state, or local law. We will also consider qualified applicants with arrest and conviction records consistent with local law.

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