Responsibilities:

1. Provide technical support to customers, including on-site visits, to ensure the successful integration of Bosch semiconductor products into customers’ applications.

2. Troubleshoot and resolve technical issues related to SiC bare die products, including common failure modes and application challenges.

3. Develop and deliver engineering materials, demonstrations, and application notes to customers and internal team.

4. Manage complex cross-team projects involving cross-departmental collaboration to drive business success.

岗位职责：

1.为客户提供技术支持，包括开展现场技术服务，确保博世半导体产品成功集成至客户应用系统中。

2.排查并解决与碳化硅（SiC）裸片产品相关的各类技术问题，涵盖常见失效模式及应用过程中遇到的技术难点。

3.编制并向客户及内部团队交付技术资料、演示方案及应用指南。

4.统筹管理复杂的跨团队项目，协调多部门协作，推动业务目标达成。

Qualifications:

1. Master’s degree or above with major in Automotive/Electrical Engineering/Intelligent Connected Vehicle Engineering or related majors.

2. 2 years of working experience in automotive electronics, with experience in power semiconductors and ADAS.

3. Deep knowledge of automotive airbags, ADAS, and autonomous driving.

4. Strong understanding of SiC bare die electrical properties, including switching characteristics, thermal behavior, and reliability.

5. Knowledge of SiC chip applications, particularly in high-power and high-voltage environments, e.g. traction inverters.

6. Automotive working experience in embedded, Linux, android software is preferred.

7. Automotive working experience in ISO26262 functional safety.

任职要求：

1.硕士及以上学历，汽车工程、电气工程、智能网联汽车工程或相关专业背景。

2.具备 2 年及以上汽车电子领域工作经验，熟悉功率半导体、高级驾驶辅助系统（ADAS）相关技术。

3.精通汽车安全气囊、高级驾驶辅助系统（ADAS）及自动驾驶相关技术。

4.深入掌握碳化硅（SiC）裸片的电气特性，包括开关特性、热性能及可靠性相关知识。

5.了解碳化硅（SiC）芯片应用技术，尤其熟悉其在大功率、高电压场景下的应用，例如车载牵引逆变器领域。

6.具备汽车领域嵌入式、Linux、Android 系统相关工作经验者优先。

7.具备汽车行业 ISO 26262 功能安全相关工作经验。

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