Who We Are

Applied Materials is a global leader in materials engineering solutions used to produce virtually every new chip and advanced display in the world. We design, build and service cutting-edge equipment that helps our customers manufacture display and semiconductor chips – the brains of devices we use every day. As the foundation of the global electronics industry, Applied enables the exciting technologies that literally connect our world – like AI and IoT. If you want to push the boundaries of materials science and engineering to create next generation technology, join us to deliver material innovation that changes the world.

What We Offer

Location:

Icheon-Gwango,KOR

You’ll benefit from a supportive work culture that encourages you to learn, develop, and grow your career as you take on challenges and drive innovative solutions for our customers. We empower our team to push the boundaries of what is possible—while learning every day in a supportive leading global company. Visit our Careers website to learn more.

At Applied Materials, we care about the health and wellbeing of our employees. We’re committed to providing programs and support that encourage personal and professional growth and care for you at work, at home, or wherever you may go. Learn more about our benefits.

Key Responsibilities:

• Lead advanced packaging process engagements with Korea‑based customers (SK Hynix, Samsung Electronics), establishing trusted technical partnerships and translating customer requirements into Fab Vantage value‑added solutions.
• Familiar with Adv pkg process such as plating, CVD, PVD, CMP would be plus.
• Identify, analyze, and resolve high‑value process integration issues using Fab Vantage methodologies, advanced data analytics, and AI‑enabled tools (JMP, FSS, AIx).
• Define and implement best practices for advanced packaging modules, enabling service opportunities across plating, hybrid bonding, CMP, CVD, PVD, and related areas in support of AGS sales initiatives.
• Provide technical leadership across cross‑functional teams including process, hardware, metrology, and sensing to optimize module performance and troubleshoot complex integration challenges.
• Drive knowledge capture by documenting findings, authoring technical reports, and delivering clear, executive‑level presentations to internal stakeholders and customers.
• Mentor junior engineers and contribute to the development of Fab Vantage technical capability and long‑term strategy.

Required Skills & Expertise:

• Deep understanding of semiconductor backend and advanced packaging processes, including HBM, 2.5D/3D pkg, and high‑density interconnects.
• Strong proficiency in data analytics, DOE, and statistical analysis tools(JMP required); experience with AIx databases and digital Fab Vantage platforms preferred.
• Proven ability to solve complex, multi‑module process integration problems, perform rigorous root cause analysis, and deliver sustainable improvements.
• Excellent communication and technical presentation skills; Korean language proficiency required for direct customer engagement.
• Demonstrated effectiveness in customer‑facing, cross‑functional environments with measurable business impact.

Qualifications:

• Bachelor’s or Master’s degree in Engineering, Materials Science, or a related discipline.
• 7+ years or above of experience in the semiconductor or advanced packaging industry.
• Hands‑on experience in advanced packaging process strongly preferred.
• Based in Korea or willing to relocate.

Additional Information Time Type:

Full time

Employee Type:

Assignee / Regular

Travel:

Yes, 50% of the Time

Relocation Eligible:

No

Applied Materials is an Equal Opportunity Employer. Qualified applicants will receive consideration for employment without regard to race, color, national origin, citizenship, ancestry, religion, creed, sex, sexual orientation, gender identity, age, disability, veteran or military status, or any other basis prohibited by law.