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Packaging Engineer E5

Applied Materials

Packaging Engineer E5

Applied Materials

Santa Clara,CA

·

On-site

·

Full-time

·

1mo ago

Compensation

$154,000 - $212,000

Benefits & Perks

Healthcare

401(k)

Equity

Learning Budget

Healthcare

401k

Equity

Learning

Required Skills

Program management

Wafer bonding

Semiconductor packaging

Timeline management

Budget management

Leadership

Technical communication

Who We Are

Applied Materials is a global leader in materials engineering solutions used to produce virtually every new chip and advanced display in the world. We design, build and service cutting-edge equipment that helps our customers manufacture display and semiconductor chips – the brains of devices we use every day. As the foundation of the global electronics industry, Applied enables the exciting technologies that literally connect our world – like AI and IoT. If you want to push the boundaries of materials science and engineering to create next generation technology, join us to deliver material innovation that changes the world.

What We Offer

Salary:

$154,000.00 - $212,000.00

Location:

Santa Clara,CA

You’ll benefit from a supportive work culture that encourages you to learn, develop, and grow your career as you take on challenges and drive innovative solutions for our customers. We empower our team to push the boundaries of what is possible—while learning every day in a supportive leading global company. Visit our Careers website to learn more.

At Applied Materials, we care about the health and wellbeing of our employees. We’re committed to providing programs and support that encourage personal and professional growth and care for you at work, at home, or wherever you may go. Learn more about our benefits.

Location: The successful candidate will be in Santa Clara, CA as a member of a global diverse cross functional team responsible for developing new modules in Advanced Semiconductor Packaging.

Education: MS or PhD in Electrical, Mechanical Engineering, Material Engineering or equivalent

Technical Expertise: wafer to wafer bonding - including fusion and hybrid bonding, complex heterogeneous wafer level packaging, TSV, die to wafer bonding, advanced substrate and chip on wafer stacking.

Skills: Program management, Timeline management, Budget Management, Strong Interpersonnel skills, Leadership, Oral and written communications in English.

Responsibilities:

The successful candidate will be responsible for:

  • Program Managing customer engagements in Advanced Packaging, with focus on thermal management, by creating timelines, budgets, manage the technology risks, create roadmaps and execute to set plans to budget and time.
  • Developing new modules leveraging Applied’s wide equipment portfolio and help advice the packaging Business Unit on equipment requirements for Advanced semiconductor packaging.
  • Filing new patentable developments.
  • Being an engineering expert in semiconductor packaging and help drive cross functional projects by working with engineers, managers and Senior/Managing directors across Applied’s business units, including the packaging business unit.
  • Helping structure and maintain Applied’s roadmap in Packaging modules.
  • Representing Integration Module Solutions (IMS) as a module specialist to various business units within Applied and to customers, outside Applied.
  • Defining engineering plans, design DOEs, help characterize and create engineering reports for advanced packaging.
  • Creating roadmaps for some packaging applications and helping to shepherd Applied’s product portfolio.
  • Lead project across organization and culture in a fast-paced environment
  • Self-starter, team player and able to work independently with minimal supervision

Additional Information

Time Type:

Full time

Employee Type:

Assignee / Regular

Travel:

Yes, 20% of the Time

Relocation Eligible:

Yes

The salary offered to a selected candidate will be based on multiple factors including location, hire grade, job-related knowledge, skills, experience, and with consideration of internal equity of our current team members. In addition to a comprehensive benefits package, candidates may be eligible for other forms of compensation such as participation in a bonus and a stock award program, as applicable.

For all sales roles, the posted salary range is the Target Total Cash (TTC) range for the role, which is the sum of base salary and target bonus amount at 100% goal achievement.

Applied Materials is an Equal Opportunity Employer. Qualified applicants will receive consideration for employment without regard to race, color, national origin, citizenship, ancestry, religion, creed, sex, sexual orientation, gender identity, age, disability, veteran or military status, or any other basis prohibited by law.

In addition, Applied endeavors to make our careers site accessible to all users. If you would like to contact us regarding accessibility of our website or need assistance completing the application process, please contact us via e-mail at Accommodations_Program@amat.com, or by calling our HR Direct Help Line at 877-612-7547, option 1, and following the prompts to speak to an HR Advisor. This contact is for accommodation requests only and cannot be used to inquire about the status of applications.

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About Applied Materials

Applied Materials

Applied Materials, Inc. is an American corporation that supplies equipment, services and software for the manufacture of semiconductor chips for electronics, flat panel displays for computers, smartphones, televisions, and solar products.

10,001+

Employees

Santa Clara

Headquarters

Reviews

4.0

1 reviews

Work Life Balance

2.0

Compensation

3.0

Culture

2.5

Career

2.5

Management

2.0

25%

Recommend to a Friend

Pros

Decent pay

Cons

Poor work-life balance

Limited pay raises

Management does not address issues

Salary Ranges

37 data points

L2

L3

L4

L5

L6

Mid/L4

L2 · Financial Analyst L2

0 reports

$92,625

total / year

Base

$37,050

Stock

$46,313

Bonus

$9,263

$64,837

$120,413

Interview Experience

4 interviews

Difficulty

3.0

/ 5

Duration

14-28 weeks

Offer Rate

25%

Experience

Positive 25%

Neutral 75%

Negative 0%

Interview Process

1

Interview

2

Second Round Interview