Who We Are

Applied Materials is a global leader in materials engineering solutions used to produce virtually every new chip and advanced display in the world. We design, build and service cutting-edge equipment that helps our customers manufacture display and semiconductor chips – the brains of devices we use every day. As the foundation of the global electronics industry, Applied enables the exciting technologies that literally connect our world – like AI and IoT. If you want to push the boundaries of materials science and engineering to create next generation technology, join us to deliver material innovation that changes the world.

What We Offer

Location:

Singapore,SGP

You’ll benefit from a supportive work culture that encourages you to learn, develop, and grow your career as you take on challenges and drive innovative solutions for our customers. We empower our team to push the boundaries of what is possible—while learning every day in a supportive leading global company. Visit our Careers website to learn more.

At Applied Materials, we care about the health and wellbeing of our employees. We’re committed to providing programs and support that encourage personal and professional growth and care for you at work, at home, or wherever you may go. Learn more about our benefits.

We’re hiring a GPS Engineer to support new product design, introduction, and field readiness for our Hybrid Bonding products in Singapore. The ability to understand Automation, robotic and semiconductor substrate handling, is a must. You’ll work cross-functionally with Supplier Manufacturing, Internal Business Units, Quality & Reliability, and Field teams to drive installation readiness, serviceability, reliability, and learnings into product design.

What You’ll Do

New Product Intro & Lab Builds

• Participate in / own first product build & test in SGP lab; support new product final test as required.

• Own beta site test plans and reporting; drive resolution with System and Design Engineering.

• Maintain knowledge of clean room etiquette and system processes, and be capable of performing field service on delivered systems

Field Readiness & Documentation

• Develop Installation Plans, Technical Product Manuals, Preventive/Corrective Maintenance procedures, and Troubleshooting Guides.

• Create and release Lessons Learned, Best Known Methods (BKMs), Customer Engineering Notices (CENs), and Internal Service Bulletins (ISBs).

• Contribute to FMECA and ensure legacy corrective actions are integrated into new designs.

• Resolution owner for lab NCs and effective closure through documentation and change order requirements

Supplier & BU Collaboration

• Partner with Supplier Manufacturing and Business Units to develop OMS procedures for Field and Escalation teams.(Start-up, PM, CM manuals and lessons learned), sharing with system engineering team.

• Work with Documentation teams to publish high-quality procedures; collaborate with Engineering to resolve issues discovered in lab or field.

Quality, Reliability & Escalations

• Partner with Quality & Reliability (Q&R) on top field issues; participate in or own CAPA (8D) processes.

• Conduct or facilitate Failure Analysis (FA); collect process and qualification data to build BKMs.

Training & Parts Readiness

• Build initial training for new products and partner with Global Technical Training (GTT) to deliver and scale training (“train-the-trainer”).

• Train CEs, PSEs, TPS prior to ELS shipments.

• Identify new spare parts; coordinate with AGS to stock in correct locations.

Design Reviews

• Participate in Engineering Design Reviews; ensure Lessons Learned and corrective actions are captured in design intent for new products.

What You Bring

• Education: Bachelor’s degree (Engineering or related field preferred).

• Experience: 2–4 years in hardware, semiconductor capital equipment, robotics/EFEM, or complex electro-mechanical systems.

• Technical Skills:

Automation, robot and substrate handling experience (SCARA/Cartesian arms, prealigners, end‑effectors) and integrating LPs and FOUP openers with substrate mapping and presence sensors

• Knowledge of Software control systems including Firmware control systems

• Install/startup, retrofit, maintenance documentation for complex systems

• FMECA, FA, CAPA or 8D methodologies

• Data collection/analysis for qualification and BKMs

• Reading schematics/prints; familiarity with robotics/handlers/EFEMs is a plus

• Soft Skills:

Strong cross-functional communication; able to explain complex topics simply

• Problem-solving using technical judgment and precedents; leads others on complex issues

• Drives outcomes across BU, supplier, and customer interfaces

• Ability to communicate with Internal and supplier resources

Nice to Have

• Service/Field procedure writing

• Experience with beta site test plans and customer-facing escalations

• Prior training experience (GTT or equivalent “train the trainer”)

Work Location

• Science Park II (Moving to Tampines in end 2026)

Additional Information

Time Type:

Full time

Employee Type:

Assignee / Regular

Travel:

Yes, 10% of the Time

Relocation Eligible:

No

Applied Materials is an Equal Opportunity Employer. Qualified applicants will receive consideration for employment without regard to race, color, national origin, citizenship, ancestry, religion, creed, sex, sexual orientation, gender identity, age, disability, veteran or military status, or any other basis prohibited by law.