채용

Account Technologist (PVD Advanced Packaging)
Singapore,SGP; Tainan,TWN; Linkou,TWN; Hukou,TWN; Hsinchu,TWN; Guany-in,TWN; Kaohsiung,TWN; Taichung,TWN
·
On-site
·
Full-time
·
4mo ago
복지 및 혜택
•Healthcare
•Learning
필수 스킬
PVD process engineering
Advanced packaging
Process qualification
Customer engagement
Who We Are
Applied Materials is a global leader in materials engineering solutions used to produce virtually every new chip and advanced display in the world. We design, build and service cutting-edge equipment that helps our customers manufacture display and semiconductor chips – the brains of devices we use every day. As the foundation of the global electronics industry, Applied enables the exciting technologies that literally connect our world – like AI and IoT. If you want to push the boundaries of materials science and engineering to create next generation technology, join us to deliver material innovation that changes the world.
What We Offer
Location:
Guany-in,TWN, Hsinchu,TWN, Hukou,TWN, Kaohsiung,TWN, Linkou,TWN, Singapore,SGP, Taichung,TWN, Tainan,TWN
You’ll benefit from a supportive work culture that encourages you to learn, develop, and grow your career as you take on challenges and drive innovative solutions for our customers. We empower our team to push the boundaries of what is possible—while learning every day in a supportive leading global company. Visit our Careers website to learn more.
At Applied Materials, we care about the health and wellbeing of our employees. We’re committed to providing programs and support that encourage personal and professional growth and care for you at work, at home, or wherever you may go. Learn more about our benefits.
Key Responsibilities
Enable Next-Gen Solutions Through Direct Engagement:
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Act as the technical owner for PVD solutions at assigned OSATs and Fabless accounts, ensuring alignment between design requirements and manufacturing processes.
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Understand Customers and Fabless stakes holders technical roadmap.
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Partner with Fabless packaging architects to define material stacks, reliability criteria, and integration flows; translate these into executable solutions for OSATs.
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Lead joint qualification programs involving Fabless and OSAT stakeholders: define success metrics, Do Es, and acceptance gates; manage execution to schedule.
Process Qualification & Ramp:
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Establish process-of-record (POR) for advanced packaging applications (e.g., RDL barrier/seed, TSV liners, hybrid bonding underlayers).
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Drive tool acceptance (FAT/SAT) and HVM ramp at OSAT sites: SPC setup, chamber matching, defectivity control, and yield stabilization.
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Validate PVD film integrity under Fabless-driven reliability tests (JEDEC/IPC standards: EM, TDDB, thermal cycling).
Cross-Functional Collaboration:
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Coordinate with Applied Materials’ Product Engineering, Field Service, and Quality teams to deliver robust solutions tailored to OSAT and Fabless needs.
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Resolve integration challenges across packaging flows (e.g., ESD, adhesion, contamination, stress) through structured problem-solving.
Continuous Improvement:
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Lead structured root cause analysis on yield/reliability excursions; implement corrective actions and verify effectiveness.
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Provide feedback to internal engineering for hardware and process enhancements based on OSAT and Fabless requirements.
Required Qualifications
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Bachelor’s or Master’s in Materials Science, Physics, Chemical Engineering, or related field; PhD preferred.
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10+ years in semiconductor equipment/process engineering with strong PVD experience in Advanced Packaging (FO-WLP, 2.5D/3D, RDL/UBM).
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Proven success enabling solutions through direct engagement with OSATs and Fabless design houses.
Preferred Qualifications
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Experience enabling hybrid bonding or chiplet integration through PVD underlayers.
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Familiarity with APAC OSAT ecosystem and Fabless packaging roadmaps.
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Proficiency in SPC, DOE, metrology, and yield analytics.
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Expertise in thin-film metallurgy (Cu, Ni, Ti, Ta/TaN, Co) and reliability-critical stack design.
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Strong communication skills to engage executive Fabless stakeholders and OSAT engineering teams.
Work Location
- Science Park II (Moving to Tampines in end 2026)
Additional Information
Time Type:
Full time
Employee Type:
Assignee / Regular
Travel:
Relocation Eligible:
No
Applied Materials is an Equal Opportunity Employer. Qualified applicants will receive consideration for employment without regard to race, color, national origin, citizenship, ancestry, religion, creed, sex, sexual orientation, gender identity, age, disability, veteran or military status, or any other basis prohibited by law.
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Applied Materials 소개

Applied Materials
PublicApplied Materials, Inc. is an American corporation that supplies equipment, services and software for the manufacture of semiconductor chips for electronics, flat panel displays for computers, smartphones, televisions, and solar products.
10,001+
직원 수
Santa Clara
본사 위치
$57B
기업 가치
리뷰
3.5
10개 리뷰
워라밸
3.2
보상
4.1
문화
3.8
커리어
2.7
경영진
2.5
65%
친구에게 추천
장점
Good compensation and benefits
Innovative and interesting projects
Supportive colleagues and inclusive workplace
단점
Limited career advancement opportunities
Poor management and lack of direction
High pressure and demanding work environment
연봉 정보
53개 데이터
L2
L3
L4
L5
L6
Mid/L4
L2 · Financial Analyst L2
0개 리포트
$92,625
총 연봉
기본급
$37,050
주식
$46,313
보너스
$9,263
$64,837
$120,413
면접 경험
4개 면접
난이도
3.0
/ 5
소요 기간
14-28주
합격률
25%
경험
긍정 25%
보통 75%
부정 0%
면접 과정
1
Interview
2
Second Round Interview
뉴스 & 버즈
Lobbying Update: $760,000 of APPLIED MATERIALS INC lobbying was just disclosed - Quiver Quantitative
Quiver Quantitative
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3d ago
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3d ago
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Seeking Alpha
News
·
3d ago
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News
·
4d ago