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Do you have the attention for details and love for excellence to work towards an extraordinary result? Envision what you could do here! At Apple, we believe new insights have a way of becoming extraordinary products, services, and customer experiences very quickly. Bring passion and dedication to your job and there's no telling what you could accomplish!
Our Hardware Technology Packaging team invents, designs, develops and integrates electronic packaging solutions for Apple's internal and custom external components of hardware for its consumer electronic products such as i Phone, i Pad, Mac, Apple Watch, Apple TV, etc.
In this highly visible role, you will own and drive sophisticated package selection, new generation product package structure and configuration optimization. You will be responsible for Package/SIP/module physical design and layout, optimization, DV and tape out; and work with multi-functional teams to achieve optimized mechanical/electrical/ thermal performance for various types of chips.
Description
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Implement the physical design of packages and modules for SoC, Memory, RF, and cellular chips.
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Interface and coordinate with multi-functional groups throughout Apple on new product package/SiP/module feasibility analysis, design and selection.
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Define and develop design verification and automation strategy to strengthen and streamline package design as well as release flows.
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Work multi-functionally to optimize package pin out.
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Perform extraction of S-parameters and package RLGC model.
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Ensure package design is optimized with SI/PI requirements.
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Drive methodology, innovations, and efficiency improvements in package design together with vendors and developers on feature development and bug resolution.
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Explore, evaluate and develop new CAD tool, design and verification flow.
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Partner with Silicon PD team to optimize chip Floorplan and bump placement, and minimize package size.
Preferred Qualifications
As the IC Package Design Engineer, you demonstrate fundamental knowledge or proven experience in the following:
Proven fundamentals in the electrical/material/thermal/ or mechanical engineering field(s).
Familiarity with various sophisticated package configurations and assembly/ substrate technology (wirebond, POP, etc.).
Experience in package design and proficient in Cadence Allegro platform tools (PCB Editor, Advanced Package Designer, APD/SiP) or Mentor Xpedition platform tools.
Basic understanding in some SI/PI tools (XtractIM, PowerSI, HFSS, Q3D, etc.), package model extraction, S-parameters and RLGC model.
Basic knowledge of substrate manufacturing process, structure, design rules and material property.
Proven understanding of high-speed interfaces, including DDR, PCIe, NAND, etc.
Exposure to Unix environment, scripting languages (PERL, Python, TCL and or shell) and methodology.
Preferred Skills:
Familiarity with CAM350/Valor or Calibre and CAD and experience with package design reviews.
Knowledge of high-speed layout constraints (crosstalk mitigation, differential pairs, EMI/RFI, PCB/package resonance).
Design experience with RFIC and 5G packages, SIP or module schematic and layout design experience.
Solid understanding of Design Rules Check and Design for Manufacturing.
Minimum Qualifications
BS and 3+ years of relevant industry experience
Apple is an equal opportunity employer that is committed to inclusion and diversity. We seek to promote equal opportunity for all applicants without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, disability, Veteran status, or other legally protected characteristics. Learn more about your EEO rights as an applicant .
Pay & Benefits
At Apple, base pay is one part of our total compensation package and is determined within a range. This provides the opportunity to progress as you grow and develop within a role. The base pay range for this role is between $139,500 and $258,100, and your base pay will depend on your skills, qualifications, experience, and location.
Apple employees also have the opportunity to become an Apple shareholder through participation in Apple's discretionary employee stock programs. Apple employees are eligible for discretionary restricted stock unit awards, and can purchase Apple stock at a discount if voluntarily participating in Apple's Employee Stock Purchase Plan. You'll also receive benefits including: Comprehensive medical and dental coverage, retirement benefits, a range of discounted products and free services, and for formal education related to advancing your career at Apple, reimbursement for certain educational expenses - including tuition. Additionally, this role might be eligible for discretionary bonuses or commission payments as well as relocation. Learn more about Apple Benefits.
Note: Apple benefit, compensation and employee stock programs are subject to eligibility requirements and other terms of the applicable plan or program.
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Appleについて

Apple
PublicApple Inc. is an American multinational technology company headquartered in Cupertino, California, in Silicon Valley, best known for its consumer electronics, software and online services.
10,001+
従業員数
Cupertino
本社所在地
$3.5T
企業価値
レビュー
3.9
10件のレビュー
ワークライフバランス
2.5
報酬
4.2
企業文化
3.8
キャリア
3.5
経営陣
3.2
72%
友人に勧める
良い点
Great benefits and compensation
Talented colleagues and supportive teams
Learning opportunities and mentorship
改善点
Work-life balance challenges
High stress and pressure
Fast-paced environment
給与レンジ
11,365件のデータ
L2
L3
L4
L5
L6
L2 · Business Analyst L2
0件のレポート
$114,215
年収総額
基本給
$45,686
ストック
$57,108
ボーナス
$11,422
$79,951
$148,480
面接体験
3件の面接
難易度
3.3
/ 5
期間
28-42週間
内定率
33%
体験
ポジティブ 33%
普通 0%
ネガティブ 67%
面接プロセス
1
Application Review
2
Recruiter Screen
3
Technical Phone Screen
4
Onsite/Virtual Interviews
5
Team Matching
6
Offer
よくある質問
Coding/Algorithm
System Design
Behavioral/STAR
Technical Knowledge
Past Experience
ニュース&話題
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