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Do you like to work on groundbreaking technologies that enable amazing new products? Do you have the attention for details and love for excellence to work towards an extraordinary result? Envision what you could do here! At Apple, we believe new ideas have a way of becoming extraordinary products, services, and customer experiences very quickly. Bring passion and dedication to your job and there's no telling what you could accomplish! We are looking for a hardworking, and passionate IC Packaging Engineering Lead to join our team.
Description
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Work with cross-functional teams and lead package integration and architecture efforts.
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Work with 3rd party and OSAT to bring packaging solution from concept to HVM Drive industry with advanced package solutions and specs.
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Work to bring innovative packaging solutions from concept to mass production, including package, module, and technology development.
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People managerial skills highly desirable.
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Travel - 5-10%","responsibilities":"Lead package co-design efforts with Silicon, Packaging, and Systems engineering teams to ensure designed packages meet electrical, mechanical, thermal, reliability and fit requirements.
Drive package technology development which has broad impact (new technology, structure development, enhanced performance, lower cost)
Co-work with assembly partners on new packages from development, NPI, Qualification to high volume production.
Create package design documentation, design rules, technical risk assessment, package checklist for Silicon TO, Development and release to production teams.
Preferred Qualifications
We are looking for someone with experience in Semiconductor Packaging Design, Process & Technology Development, Managerial skills highly desired.
Good understanding of cross-functional packaging areas: Si floor plan, package layout and architecture, enabling process technologies, thermal, mechanical, SI/PI, material, component & system level reliability, testing, and FA.
Knowledgeable in advanced packaging technologies: Knowledge and insight to deliver high density / high performance interconnects in various form factor, thermo-mechanical, reliability, and cost constraints.
Background and Knowledge of Cellular/Connectivity/PMU packaging highly desirable.
Excellent problem solving with strong physics and fundamentals.
Excellent communication skills that enable the candidate to work well with internal cross functional teams and overseas suppliers.
Multi-functional coverage on package layout (Cadence APD/Allegro), critical signal integrity / power integrity, thermal, design rules, BOM, design for manufacturing, reliability, and cost.
Ability to work independently and take on projects with minimum supervision.
Ability to lead and manage teams.
Minimum Qualifications
BS and 10+ years of relevant industry experience.
Apple is an equal opportunity employer that is committed to inclusion and diversity. We seek to promote equal opportunity for all applicants without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, disability, Veteran status, or other legally protected characteristics. Learn more about your EEO rights as an applicant .
Pay & Benefits
Apple accepts applications to this posting on an ongoing basis.
"},"locale Language":{"en_US":"English
- US"},"posting Date":"2026-03-05T03:55:03.104+00:00"},"post Location-SFMETRO":{"posting Supplement Footer":{"display Order":1,"content":"At Apple, base pay is one part of our total compensation package and is determined within a range. This provides the opportunity to progress as you grow and develop within a role. The base pay range for this role is between $181,100 and $318,400, and your base pay will depend on your skills, qualifications, experience, and location.
Apple employees also have the opportunity to become an Apple shareholder through participation in Apple's discretionary employee stock programs. Apple employees are eligible for discretionary restricted stock unit awards, and can purchase Apple stock at a discount if voluntarily participating in Apple's Employee Stock Purchase Plan. You'll also receive benefits including: Comprehensive medical and dental coverage, retirement benefits, a range of discounted products and free services, and for formal education related to advancing your career at Apple, reimbursement for certain educational expenses - including tuition. Additionally, this role might be eligible for discretionary bonuses or commission payments as well as relocation. Learn more about Apple Benefits.
Note: Apple benefit, compensation and employee stock programs are subject to eligibility requirements and other terms of the applicable plan or program.
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Appleについて

Apple
PublicApple Inc. is an American multinational technology company headquartered in Cupertino, California, in Silicon Valley, best known for its consumer electronics, software and online services.
10,001+
従業員数
Cupertino
本社所在地
$3.5T
企業価値
レビュー
3.9
10件のレビュー
ワークライフバランス
2.5
報酬
4.2
企業文化
3.8
キャリア
3.5
経営陣
3.2
72%
友人に勧める
良い点
Great benefits and compensation
Talented colleagues and supportive teams
Learning opportunities and mentorship
改善点
Work-life balance challenges
High stress and pressure
Fast-paced environment
給与レンジ
11,365件のデータ
L2
L3
L4
L5
L6
L2 · Business Analyst L2
0件のレポート
$114,215
年収総額
基本給
$45,686
ストック
$57,108
ボーナス
$11,422
$79,951
$148,480
面接体験
3件の面接
難易度
3.3
/ 5
期間
28-42週間
内定率
33%
体験
ポジティブ 33%
普通 0%
ネガティブ 67%
面接プロセス
1
Application Review
2
Recruiter Screen
3
Technical Phone Screen
4
Onsite/Virtual Interviews
5
Team Matching
6
Offer
よくある質問
Coding/Algorithm
System Design
Behavioral/STAR
Technical Knowledge
Past Experience
ニュース&話題
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