Annapurna Labs is at the forefront of designing custom silicon and accelerator platforms that power AWS's AI and machine learning services. As compute density and power demands continue to grow, advanced cooling technologies are critical to unlocking the full performance potential of our Trainium and Graviton processors.

We are seeking an experienced Senior Technical Program Manager (TPM) to lead the AWS Advanced Cooling program. In this role, you will drive the evaluation, qualification, and deployment of next-generation cooling technologies — including microfluidics cold plates, jet impingement systems, pumped two-phase solutions, and advanced thermal interface materials — across Annapurna's custom silicon platforms.

You will serve as the central program leader connecting thermal engineering, reliability, manufacturing, supply chain, and datacenter operations teams to ensure advanced cooling innovations move from lab evaluation to production deployment at scale.

• Key job responsibilities
• Program manage the end-to-end evaluation, qualification, and integration of advanced cooling technologies and chip packaging solutions for Annapurna's Trainium and Graviton server platforms.
• Partner with thermal/mechanical engineers, chip packaging engineers, reliability engineers, and silicon design teams to co-design cooling and packaging solutions from the earliest chip development stages.
• Drive chip packaging technology evaluation and integration, including advanced substrate designs, interposer technologies, 2.5D/3D packaging architectures, and thermal-aware packaging strategies that optimize both performance and cooling efficiency.
• Manage relationships with external cooling technology and chip packaging suppliers, driving standardized testing, performance benchmarking, and supply chain readiness assessments.
• Develop and maintain program roadmaps that align advanced cooling and chip packaging research timelines with new product introduction (NPI) schedules, ensuring innovations are production-ready when needed.
• Coordinate cross-functional teams spanning Hardware Engineering Services (HWEngS), Annapurna Labs, manufacturing, and datacenter operations to drive unified execution.
• Define and track key performance metrics — thermal performance, packaging reliability, manufacturing yield, cost, and sustainability — to inform technology selection decisions.
• Consolidate and manage program budgets across contributing organizations, ensuring efficient resource allocation.
• Communicate program status, risks, and recommendations to senior leadership, including Principal and Senior Principal engineers.
• Drive process improvements that enhance the team's operational effectiveness and scalability.
• Anticipate thermal and packaging requirements for future platforms across multi-year horizons, ensuring the technology pipeline stays ahead of silicon roadmaps.

About the team
The Accelerated and Trusted Security development team within AWS Hardware Engineering is responsible for delivering hardware as a service to our internal customers. We own all aspects of design, from concept to design to launch and then throughout the entire life of the product.

Basic Qualifications

• 5+ years of technical product or program management experience
• 7+ years of working directly with engineering teams experience
• Experience managing programs across cross functional teams, building processes and coordinating release schedules
• Experience building and evaluating system-level technical design
• Bachelor's degree in engineering, computer science or equivalent

Preferred Qualifications

• 5+ years of project management disciplines including scope, schedule, budget, quality, along with risk and critical path management experience
• Experience defining KPI's/SLA's used to drive multi-million dollar businesses and reporting to senior leadership
• Experience with thermal management, cooling systems, or datacenter infrastructure technologies
• Familiarity with liquid cooling architectures (cold plates, two-phase systems, microfluidics) and thermal interface materials
• Experience with advanced chip packaging technologies (2.5D/3D packaging, interposers, advanced substrates, or wafer-level packaging)
• Experience managing external technology suppliers, ODMs, or hardware component vendors

Amazon is committed to a diverse and inclusive workplace. Amazon is an equal opportunity employer and does not discriminate on the basis of race, national origin, gender, gender identity, sexual orientation, protected veteran status, disability, age, or other legally protected status. For individuals with disabilities who would like to request an accommodation, please visit https://www.amazon.jobs/en/disability/us.

The base salary range for this position is listed below. Your Amazon package will include sign-on payments and restricted stock units (RSUs). Final compensation will be determined based on factors including experience, qualifications, and location. Amazon also offers comprehensive benefits including health insurance (medical, dental, vision, prescription, Basic Life & AD&D insurance and option for Supplemental life plans, EAP, Mental Health Support, Medical Advice Line, Flexible Spending Accounts, Adoption and Surrogacy Reimbursement coverage), 401(k) matching, paid time off, and parental leave. Learn more about our benefits at https://amazon.jobs/en/benefits.

USA, TX, Austin - 148,700.00 - 201,200.00 USD annually