FAILURE ANALYSIS / YIELD IMPROVEMENT ENGINEER

Responsible for failure analysis, with an emphasis on driving process and tool characterization, as well as yield improvement, in a wafer fab that manufactures photonic integrated circuits. This includes:

• Operating cross-section SEMs as well as Focused Ion Beam SEMs.
• Maintaining the health of SEM equipment
• Interfacing with equipment vendors for support
• Working with internal customers to understand their requests and provide the desired data

Minimum Knowledge/Skills/Abilities

• Experience with Failure Analysis equipment in a wafer fab environment

• Data analysis skills

• Excellent communication skills, writing reports and presenting findings

• Work in a team environment consisting of engineers and operators

• Ability to work in a fast-paced environment and meet business needs with short deadlines

• Experience with III-V devices a plus

Education Required:

Requires a BS degree in Electrical Engineering, Materials Science, Physics or a related field, with a concentration in microelectronics, optoelectronics, electronics, or physics plus 2-3 years of experience or a MS degree in Electrical Engineering, Materials Science, Physics or a related field.

Essential Functions and Key Responsibilities:

• Prepare samples and perform failure analysis work (FIB/Cross-section/EDX/etc.)
• Review diagnostic/test data of current and next generation products to identify issues, plan FA next steps (what type of FA, sampling plan, etc.)
• Interpret FA outcomes and determine root cause of device failures
• Present FA findings and work with stakeholders to implement recommendations for improvement arising from FA analysis
• Coordinate with outside providers for FA work that cannot be done in-house