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APTD SG TD Integrator

Micron

APTD SG TD Integrator

Micron

Taichung - MTB, Taiwan

·

On-site

·

Full-time

·

4d ago

Required Skills

Project Management

Our vision is to transform how the world uses information to enrich life for all.

Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.

As part of APTD SG Technology Development Process Integrator, you will be responsible for developing advanced packaging process solution and ensure New Process, New Equipment, New Material and Path finding activities success for all adv pkg products in Micron.

To lead new Technode process readiness and improving the yield, quality and reliability with process characterization and optimization and new materials, machines & technologies introduction. You will need to have understanding of Frontend Process, packaging requirements, chip package interaction, equipment understanding and process technology in the industry. The ability to enable best technology for New Technode with packaging requirements. You will also be required to drive & collaborate with cross functional teams to resolve process related problems.

Ensure smooth transition from new process development, 1st qualification success to small volume production launch

  • Development and Qualification of new packaging process, material, equipment and technology solutions to meet new Technode requirements and schedule
  • Perform CPI NUDD, process TRA, risk mitigation execution and process recipe readiness prior Silicon arrives and ensure 1st pass rate.
  • Qualify new process/technology/equipment/materials

Technical capability

  • Identify path finding opportunities for Micron's technology leadership with BIC time to market, continuous yield improvement, cost efficiency & touchpoint optimizations
  • To understand and be able to integrate process knowledge between upstream and downstream across Si and assembly/packaging process
  • Understand the future trend, technology and capabilities required for future packaging solutions, work with teams to put in place new capabilities to enhance process performance.
  • Provide new solutions on time to meet company and customer needs
  • Define, develop and establish process capabilities, strategy and roadmap
  • To develop & engage creative solutions for new capabilities or to overcome the identified process constraints, ahead product requirements.

Job Requirements

  • PhD/Masters/Bachelor’s Degree in Electrical & Electronic, Material, Mechanical Engineering, Physics & Applied Physics or Equivalent Work Experience Required
  • 8 years' experience in semiconductor industry
  • Experience in Frontend fab Process integration or Module process with technical knowledge on wafer and die level process technology
  • Understanding of Micron’s silicon and how it interacts at backend process & package level through CPI
  • Strong project management skills to ensure execution to timelines
  • Strong communication and presentation skills
  • Understanding of business needs and customers’ requirement
  • Ability to integrate & cooperate with people from cross function teams

About Micron Technology, Inc.

We are an industry leader in innovative memory and storage solutions transforming how the world uses information to enrich life for all. With a relentless focus on our customers, technology leadership, and manufacturing and operational excellence, Micron delivers a rich portfolio of high-performance DRAM, NAND, and NOR memory and storage products through our Micron® and Crucial® brands. Every day, the innovations that our people create fuel the data economy, enabling advances in artificial intelligence and 5G applications that unleash opportunities — from the data center to the intelligent edge and across the client and mobile user experience.

To learn more, please visit micron.com/careers

All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, veteran or disability status.

To request assistance with the application process and/or for reasonable accommodations, please contact at hrsupport_taiwan@micron.com.

Micron Prohibits the use of child labor and complies with all applicable laws, rules, regulations, and other international and industry labor standards.

Micron does not charge candidates any recruitment fees or unlawfully collect any other payment from candidates as consideration for their employment with Micron.

AI alert: Candidates are encouraged to use AI tools to enhance their resume and/or application materials. However, all information provided must be accurate and reflect the candidate's true skills and experiences. Misuse of AI to fabricate or misrepresent qualifications will result in immediate disqualification.

Fraud alert: Micron advises job seekers to be cautious of unsolicited job offers and to verify the authenticity of any communication claiming to be from Micron by checking the official Micron careers website in the About Micron Technology, Inc.

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About Micron

Micron

Micron

Public

Micron Technology is a global leader in memory and storage solutions, manufacturing DRAM, NAND flash memory, and solid-state drives for computing, mobile, automotive, and data center applications.

10,001+

Employees

Boise

Headquarters

$100B

Valuation

Reviews

3.5

3 reviews

Work Life Balance

2.0

Compensation

4.0

Culture

2.0

Career

4.0

Management

1.5

Pros

Good learning opportunities

High salary/good pay

Multiple positions available

Cons

Poor work-life balance

Excessive overtime

Management disagreements

Salary Ranges

37 data points

Junior/L3

Mid/L4

Junior/L3 · Business Intelligence Analyst

1 reports

$115,042

total / year

Base

$100,037

Stock

-

Bonus

-

$115,042

$115,042

Interview Experience

4 interviews

Difficulty

2.8

/ 5

Duration

14-28 weeks

Offer Rate

25%

Experience

Positive 25%

Neutral 25%

Negative 50%

Interview Process

1

Application Review

2

Recruiter/Phone Screen

3

Technical Interview

4

Final Round Interview

5

Offer

Common Questions

Coding/Algorithm

Technical Knowledge

Behavioral/STAR

Past Experience