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JobsMicron

Product Integration Lead, HIG High Bandwidth Memory

Micron

Product Integration Lead, HIG High Bandwidth Memory

Micron

Fab 10A, Singapore

·

On-site

·

Full-time

·

4d ago

Our vision is to transform how the world uses information to enrich life for all.

Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing.

**Our vision is to transform how the world uses information to enrich life for all.**Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.

As a Product Integration Lead in the HIG HBM Product Development Team at Micron Technology, you will be responsible for integrating Micron's leading edge HBM products into end-system requirements. You will be the key representative driving HBM development swimlane requirements (SCD) to meet end-systems needs. With a deep understanding of both HBM and System capabilities, you will set Product Development priorities and manage new change initiative requests to meet rapidly evolving customer demans with agility. You will drive resolution of technical challenges in the development cycle, identifying opportunities to ensure HBM solutions are executed within the boundary of development schedule, risks and incremental development costs.

Key Responsibilities include, but are not limited to:

  • Manage technical inputs and drive silicon-system alignment on requirements and commitments using the Success Criteria Document (SCD).

  • Collaborate with HBM Architecture, Product and Systems Engineering, Business Unit, Technology Development, Packaging and Global Quality Teams to achieve competitive systems and resolve any gaps between HBM commit and system requirements.

  • Understand sample usage and any gaps in capability to system requirements, managing HBM sample delivery in sync with system development needs and timelines. Assist with risk assessment of identified issues.

  • Lead Triage Team for any System or Chip Feature Interaction requiring clarity of failure ownership domain. Coordinate mitigations with key stakeholders.

  • Manage Qualification Definition and Changes, driving the Change Control Board for Late/Post Qual Changes.

  • Communicate proper priorities within HBM Development team to maintain focus on achieving system specs and address concerns with Component and System teams.

Key Requirements:

  • Bachelor’s Degree or Master’s Degree in Electrical or Computer Engineering.

  • 10+ years of demonstrated ability in Product, Design, Yield Enhancement, or related engineering fields. Experience with product development projects is a plus.

  • Proven capability to lead technical issues to closure with creative, effective solutions through a highly collaborative approach.

  • D esire to develop knowledge and expertise in overall HBM to System development. Knowledge of DRAM/HBM device/design and system management is beneficial.

  • Excellent interpersonal, communication and presentation skills to gather technical information from engineering key stakeholders and drive technical issue resolution/mitigation.

About Micron Technology, Inc.

We are an industry leader in innovative memory and storage solutions transforming how the world uses information to enrich life for all. With a relentless focus on our customers, technology leadership, and manufacturing and operational excellence, Micron delivers a rich portfolio of high-performance DRAM, NAND, and NOR memory and storage products through our Micron® and Crucial® brands. Every day, the innovations that our people create fuel the data economy, enabling advances in artificial intelligence and 5G applications that unleash opportunities — from the data center to the intelligent edge and across the client and mobile user experience.

To learn more, please visit micron.com/careers

All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, veteran or disability status.

To request assistance with the application process and/or for reasonable accommodations, please contact hrsupport_sg@micron.com

Micron Prohibits the use of child labor and complies with all applicable laws, rules, regulations, and other international and industry labor standards.

Micron does not charge candidates any recruitment fees or unlawfully collect any other payment from candidates as consideration for their employment with Micron.

AI alert: Candidates are encouraged to use AI tools to enhance their resume and/or application materials. However, all information provided must be accurate and reflect the candidate's true skills and experiences. Misuse of AI to fabricate or misrepresent qualifications will result in immediate disqualification.

Fraud alert: Micron advises job seekers to be cautious of unsolicited job offers and to verify the authenticity of any communication claiming to be from Micron by checking the official Micron careers website in the About Micron Technology, Inc.

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About Micron

Micron

Micron

Public

Micron Technology is a global leader in memory and storage solutions, manufacturing DRAM, NAND flash memory, and solid-state drives for computing, mobile, automotive, and data center applications.

10,001+

Employees

Boise

Headquarters

$100B

Valuation

Reviews

3.5

3 reviews

Work Life Balance

2.0

Compensation

4.0

Culture

2.0

Career

4.0

Management

1.5

Pros

Good learning opportunities

High salary/good pay

Multiple positions available

Cons

Poor work-life balance

Excessive overtime

Management disagreements

Salary Ranges

37 data points

Junior/L3

Mid/L4

Senior/L5

Director

Junior/L3 · Area Manufacturing Engineer

1 reports

$109,825

total / year

Base

$95,500

Stock

-

Bonus

-

$109,825

$109,825

Interview Experience

4 interviews

Difficulty

2.8

/ 5

Duration

14-28 weeks

Offer Rate

25%

Experience

Positive 25%

Neutral 25%

Negative 50%

Interview Process

1

Application Review

2

Recruiter/Phone Screen

3

Technical Interview

4

Final Round Interview

5

Offer

Common Questions

Coding/Algorithm

Technical Knowledge

Behavioral/STAR

Past Experience