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Package Reliability Engineer/Senior Package Reliability Engineer
Penang, Malaysia - Grande
·
On-site
·
Full-time
·
2w ago
Required Skills
Package Reliability
Quality Assurance
Problem Solving
Analytical Skills
Communication
Project Coordination
Our vision is to transform how the world uses information to enrich life for all.
Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.
As a GQ (Global Quality) Package Reliability Engineer at Micron Technology Inc., you will be responsible for package quality and reliability for one of Micron’s product lines. This responsibility includes coordinating package qualification efforts for new products and when new designs, materials, or processes are introduced; and providing recommendations on product release based on package reliability test results. You will also be expected to devise reliability test plans to assess risk associated with excursions, conversions, and reliability and qualification issues. You will coordinate root cause and corrective action efforts within the GQ department for package related qualification failures and RMA’s, and prepare reports for discussion. Additional duties include providing support to internal and external customers for package-related quality and reliability issues, and customer requests.
As a GQ (Global Quality) Package Reliability Engineer at Micron Technology Inc., you will be responsible for package quality and reliability for one of Micron’s product lines. This responsibility includes coordinating package qualification efforts for new products and when new designs, materials, or processes are introduced; and providing recommendations on product release based on package reliability test results. You will also be encouraged to devise reliability test plans to assess risk associated with excursions, conversions, and reliability and qualification issues. You will coordinate root cause and corrective action efforts within the GQ department for package related qualification failures and RMA’s, and prepare reports for discussion. Additional duties include providing support to internal and external customers for package-related quality and reliability issues, and customer requests.
Responsibilities:
- Detailed knowledge of semiconductor component package assembly processes and challenges
- Knowledge of surface mount
- Understanding of mechanical and material interaction effects on reliability of IC components and/or Printed Circuit Assemblies (PCB) assemblies
- Good understanding of the effects thermomechanical, thermal, mechanical and hygroscopic swelling stresses on package reliability
- Knowledge of industry standard reliability test methods, acceleration models used for life predictions, and sampling statistics preferred
- Must be self-motivated, able to work independently, and detail oriented
- Strong analytical problem solving skills, excellent multi-tasking skills and the ability to interact easily with other groups
- Good written and verbal communication skills
- Strong understanding on software systems employed in backend manufacturing is a plus
Qualification Requirements:
- Minimum of BS degree, M. Sc or equivalent experience in Engineering.
- Any experience in Micro Electronic Packaging, Quality/Reliability Engineering, Failure Analysis, or a related field preferred.
About Micron Technology, Inc.
We are an industry leader in innovative memory and storage solutions transforming how the world uses information to enrich life for all. With a relentless focus on our customers, technology leadership, and manufacturing and operational excellence, Micron delivers a rich portfolio of high-performance DRAM, NAND, and NOR memory and storage products through our Micron® and Crucial® brands. Every day, the innovations that our people create fuel the data economy, enabling advances in artificial intelligence and 5G applications that unleash opportunities — from the data center to the intelligent edge and across the client and mobile user experience.
To learn more, please visit micron.com/careers
All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, veteran or disability status.
To request assistance with the application process and/or for reasonable accommodations, please contact hrsupport_mymicron.com
Micron Prohibits the use of child labor and complies with all applicable laws, rules, regulations, and other international and industry labor standards.
Micron does not charge candidates any recruitment fees or unlawfully collect any other payment from candidates as consideration for their employment with Micron.
AI alert**:** Candidates are encouraged to use AI tools to enhance their resume and/or application materials. However, all information provided must be accurate and reflect the candidate's true skills and experiences. Misuse of AI to fabricate or misrepresent qualifications will result in immediate disqualification.
Fraud alert: Micron advises job seekers to be cautious of unsolicited job offers and to verify the authenticity of any communication claiming to be from Micron by checking the official Micron careers website in the About Micron Technology, Inc.
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Micron
PublicMicron Technology is a global leader in memory and storage solutions, manufacturing DRAM, NAND flash memory, and solid-state drives for computing, mobile, automotive, and data center applications.
10,001+
Employees
Boise
Headquarters
$100B
Valuation
Reviews
3.5
3 reviews
Work Life Balance
2.0
Compensation
4.0
Culture
2.0
Career
4.0
Management
1.5
Pros
Good learning opportunities
High salary/good pay
Multiple positions available
Cons
Poor work-life balance
Excessive overtime
Management disagreements
Salary Ranges
37 data points
Junior/L3
Mid/L4
Junior/L3 · Business Intelligence Analyst
1 reports
$115,042
total / year
Base
$100,037
Stock
-
Bonus
-
$115,042
$115,042
Interview Experience
4 interviews
Difficulty
2.8
/ 5
Duration
14-28 weeks
Offer Rate
25%
Experience
Positive 25%
Neutral 25%
Negative 50%
Interview Process
1
Application Review
2
Recruiter/Phone Screen
3
Technical Interview
4
Final Round Interview
5
Offer
Common Questions
Coding/Algorithm
Technical Knowledge
Behavioral/STAR
Past Experience
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