Job Details:

Job Description:

Amazing experiences start with amazing opportunities in the dynamic field of silicon photonics. We are looking for an exceptional candidate to work in a fast-paced environment developing start of the art mechanical and opto-mechanical design for next generation of co-packaged optics and optical interconnect products (CPO/OCI).

You will contribute to Intel Integrated Photonics Group's (IPS) mission to transform and lead Data Center optical connectivity and enable Intel's differentiation in the networking space.
Your responsibilities will include:

• Developing opto-mechanical packaging design for state-of-the-art co-packaged Silicon Photonics (Si Ph) devices and assemblies in data center.
• Package designs and technology selection
• Assess and mitigate risks associated with the product designs
• Working with cross-functional groups to determine package requirements in order to meet electrical, optical, mechanical, thermal, and reliability requirements
• Identify new suppliers for design, develop and manage existing suppliers
• Define and conduct overall tolerance analysis for component and sub-assemblies
• Design assembly, test tooling and fixturing required for design validation
• Interacting with suppliers and optimizing designs based on supplier's processes and capabilities
• Creating component drawings, layouts, assembly drawings for product and tooling
• Generating Bill of Materials (BOM)

Qualifications:

Minimum Qualifications:

• BS with 4+ years of experience in product design and development from initial conceptual design to high volume production
• 3+ years of experience in high volume manufacturing fabrication processes including machining, sheet metal stamping, metal/plastic injection molding and die casting
• 3+ years of experience in 3D design software such as Solidworks and enterprise data management system such as ePDM, windchill
• 3+ years of experience working with product documentation, schematics, and Bill of Materials

Preferred Qualifications:

• MS or advanced degree is preferred in related engineering field.
• 3+ years of experience in product mechanical design preferably in the fiber optics or semiconductor packaging environment.
• 3+ years of design and assembly experience in high volume product environment such as optical transceivers, cell phones, disk drives or automation.
• 1+ years of experience in the optical/photonics industry.
• 2+ years of experience in product thermal design and knowledgeable on cooling devices and thermal interface materials.
• 1+ years of experience with design simulation for stress and thermal.
• 1+ years of experience in CFD (Computational Fluid Dynamics) modeling tools such as ICEPAK, FLOTHERM, etc.
• 2+ years of experience in FEA (Finite Element Analysis) structural/stress analysis and tools such as Abaqus or ANSYS.
• 2+ years of proven experience in executing complex projects that require cross-functional teamwork is preferred.

Job Type:

Experienced Hire

Shift:

Shift 1 (United States of America)

Primary Location:

US, California, Santa Clara

Additional Locations:

Business group:

At the Data Center Group (DCG), we're committed to delivering exceptional products and delighting our customers. We offer both broad-market Xeon-based solutions and custom x86-based products, ensuring tailored innovation for diverse needs across general-purpose compute, web services, HPC, and AI-accelerated systems. Our charter encompasses defining business strategy and roadmaps, product management, developing ecosystems and business opportunities, delivering strong financial performance, and reinvigorating x86 leadership. Join us as we transform the data center segment through workload driven leadership products and close collaboration with our partners.

Posting Statement:

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

Position of Trust

N/A

Benefits

We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel.

Annual Salary Range for jobs which could be performed in the US: $141,910.00-269,100.00 USD

The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.

Work Model for this Role

This role will require an on-site presence. Job posting details (such as work model, location or time type) are subject to change.

ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.